Hanmi Semiconductor is showing a big AI packaging lineup at SEMICON Taiwan. The company is already No.1 in HBM TC bonders and now pushing deeper into 2.5D equipment for AI chips, plus HBM4 tools and a next-gen Wide TC bonder for larger DRAM dies. Hanmi Semiconductor is showcasing five models of 2.5D packaging equipment: FC Bonder 3.5 FC Bonder 75 2.5D TC Bonder 40 C2S 2.5D TC Bonder 40 C2W 2.5D TC Bonder 120 Among these, the FC Bonder 3.5, FC Bonder 75, and 2.5D TC Bonder 40 C2S and C2W have been released sequentially since the end of last year and are being supplied to global foundry and OSAT companies for mass production, while the 2.5D TC Bonder 120 is scheduled for release soon. Hanmi Semiconductor official stated, "Semicon Taiwan is a global event where AI semiconductor technologies converge," adding, "Hanmi Semiconductor will lead the growth of the AI ​​semiconductor market by expanding the supply of advanced packaging equipment not only for its globally leading HBM TC Bonder but also for the AI ​​system semiconductor market." #HanmiSemiconductor# #HBM# #AI# #Semiconductors#

Hanmi Semiconductor (042700 KS), which makes bonding equipment for HBM production, reported preliminary Q3 revenue of 181.0 billion won, down 27.9% from Q2. Operating profit fell 30.3% to 90.8 billion won. Revenue was up 8.9% from a year earlier, while operating profit rose 33.9%. Operating margin widened to 50.2% from 40.8%. Hanmi said some equipment revenue had been deferred to Q4 and expects a stronger fourth quarter. The company also expects 2026 to deliver a third straight year of record revenue and a new annual high in operating profit.

BREAKING: South Korea’s Hanmi Semiconductor has secured a deal to provide advanced packaging equipment for Terafab’s AI chip production line. It is the first Korean back-end equipment maker to join the supply chain, following HPSP’s front-end equipment order in June.

Home to #Micron’s# biggest memory rivals, South Korea could also emerge as a winner from its boom. As Micron ramps HBM with most of its 2027 bit supply already locked in at higher prices, Korean suppliers like Hanmi Semiconductor could ride the wave with it.💡More: 🔗

Here is every holding currently in the xETFs Korea AI Semiconductor ETF $KSMH as of 9/18/26: SK Hynix $SKHY 20.66% weighting Samsung Electronics 19.90% Hanmi Semiconductor 7.43% DB HiTek 4.93% Jusung Engineering 4.59% Leeno Industrial 4.40% ISU Petasys 4.38% Samsung Electro-Mechanics 4.37% Wonik IPS 4.09% EO Technics 3.83% SIMMTECH 3.43% PSK 3.28% HPSP 2.87% Hana Micron 2.41% Hansol Chemical 2.32% Dongjin Semichem 1.79% ISC 1.70% Soulbrain 1.42% Techwing 1.19% S&S Tech 0.78% Everything below SK Hynix and Samsung is held through total return swaps rather than direct ownership. This is a paid advertisement. WOLF Financial and its partner accounts are compensated by xETFs to promote the Fund. This compensation creates a potential conflict of interest. Certain information contained herein has been supplied by third parties; actual performance may differ materially. To learn more about the Funds risks, expenses and holdings, or to view a prospectus, visit TUCRM-5896289-09/26

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* THE KOREA ECONOMIC DAILY: TERAFAB LARGELY COMPLETED PLACING ORDERS FOR FRONT-END SEMICONDUCTOR EQUIPMENT WITH MAJOR GLOBAL SUPPLIERS, INCLUDING ASML, APPLIED MATERIALS, LAM RESEARCH, AND TOKYO ELECTRON, IN Q2 THIS YEAR. SINCE THE START OF THE SECOND HALF, IT HAS BEEN PLACING ORDERS IN STAGES FOR BACK-END EQUIPMENT, INCLUDING PACKAGING EQUIPMENT. * THE KOREA ECONOMIC DAILY: TERAFAB AIMS TO COMPLETE ITS PILOT LINE BY THE END OF 2027 AND BEGIN OPERATIONS IN 2028. * THE KOREA ECONOMIC DAILY: SOUTH KOREA’S HANMI SEMICONDUCTOR IS SUPPLYING TERAFAB WITH PACKAGING EQUIPMENT FOR SYSTEM SEMICONDUCTORS.

Just a semi recap TLDR: - $GLW glass bridge per Morgan Stanley has potential, but hard to displace FAU (like FOCI) in short term - $SPCX Starlink Gen 3 is scaling to 100,000 units (10x prev gen) creating possible capacity constraints for suppliers of switches to CCL. - PCB supply shortages are projected to persist until 2028, and component shortages/price hikes are already forcing ODMs like Inventec to issue conservative H2 shipment - DeepSeek and Zhipu are developing custom ASICs to bypass $NVDA (kinda expected by now). - Anthropic has achieved a $30B ARR and is projected to hit >$1B in Q3 profit. Turns out these frontier labs are more profitable than people think. - US admin pressured $AAPL to source from $INTC, in exchange for tariff exception. Kinda pressuring alignment away from TSM. - $TSM plans a 30x expansion of its Photonic Integrated Circuit (PIC) capacity by 2028, growing from 500 to 25,000 wafers per month - Hanmi Semiconductor is entering the CoWoS packaging equipment market - $NVDA and NTT hosting a conference July 24th to discuss CPO strategies. - 5x general NAND flash price hike this year, market size $489B by next year triggered by RAG/inference. Samsung and SK Hynix make emergency fab investments, NAND equipment suppliers go brrrr. - Gas turbine bottleneck, 40% supply gap accompanied by staggering 5-year delivery cycles (mega-fabs need them for mass production). - AI probe card assembly has hit a severe bottleneck apparently. Which is attempted to by solved with things like Innovation Service's machines. - Nanya, 79.5% gross margins reported, memory go brr. 4x capex for capacity/advanced packaging. - CXMT's STAR Market IPO on July 16, so should bring a lot of attention to memory players in that supply chain. - KYEC $1.4B investment into US for $TSM Arizona output test facilities. Lot of these players like $AMKR and others should go brr in 2028. - $INTC CEO warned last month that helium could hinder the manufacturing costs and delivery times of AI chips - 3D NAND word lines are shifting from Tungsten to Molybdenum starting at the 375-layer node - SambaNova secured JPM for AI inference and raised $1B at an $11B valuation. - HBM prices projections to double in 2027 as $NVDA Rubin platform drives demand. - $MU provides $500 million in funding to support GlobalWafers' US manufacturing capacity - $META 'Iris' will enter mass production in September via $AVGO and TSMC and Meta aims to double computing power to 14GW by 2027. - Largan Precision has secured its first CPO FAU order, mass production slated for middle of next year (kinda indication around Foci and others). - Samsung and SK Hynix have delayed the implementation of hybrid bonding packaging technology for HBM4 apparently - Memory costs (DRAM/NAND) have reached 60% of the BOM for sub-$400 smartphones, causing a severe volume contraction. - SK Hynix successfully rasied $26.5 billion through a Nasdaq ADR - $TSLA issued procurement guidelines requiring suppliers to reach weekly production of 1,000 units by September and double to 2,000-2,500 by year end for its 3rd gen Optimus robot. Apparently Alliance Technology and A-Link may be in this supply chain harmonic reducers and vision lenses? Kinda go through all this stuff every day, but don't wanna be a news reporter so just consolidated stuff I found interesting.

Samsung and SK Hynix posted their biggest weekly drops since the 2008 crisis. Foreigners sold 8.8 trillion won of them in one week. As of today, Samsung was down 1.39% at 212,500 won and SK Hynix was down 4.25% at 1.218 million won. Last week foreigners net-sold more than 11.2 trillion won on the KOSPI. Of that, about 8.8 trillion won was Samsung and SK Hynix. The two stocks fell 17.8% and 24.3% in the week, the largest weekly drops since the 2008 financial crisis. The backdrop was a Nasdaq drop of more than 2% on the 16th, credit worries around the AI data-center firm CoreWeave, and DeepSeek’s new high-efficiency AI model, which raised questions about high-performance chip demand. Samsung’s buyback has ended and retail buying power has weakened, so the base that could absorb foreign selling is thinner. On the 19th foreigners and institutions turned to net buying and the KOSPI cut its early drop from 3.17% to the 1% range. High-bandwidth and equipment names also fell hard. Hanmi Semiconductor, EO Technics, Techwing, and others were down 4% to 7%. One exception was Sec, which jumped 13% on its first commercial order for an in-line X-ray inspection tool into a global packaging firm’s wafer-level packaging line. Broker views note a possible technical bounce after the sharp drop, but also warn of a W-shaped path that retests the low. CoreWeave’s credit risk is still unresolved, so sustained foreign flow recovery is the key variable for a semiconductor rebound. Memory spot prices remain firm. DDR5 16Gb continued higher while DDR4 was mostly flat. Hana Securities still sees a larger-than-expected fourth-quarter DRAM price rise on tight supply and keeps an overweight on semiconductors and equipment. A weekly 24% drop is not a supply glut. If foreigners already sold 8.8 trillion won of the two leaders and spot DDR5 is still rising, does the next move come from more credit headlines, or from actual contract pricing that has not cracked? #Samsung# #SKHynix#