🚨 Japan’s power semiconductor integration still a long way to go? #Rohm# reportedly says talks with #Toshiba# and #MitsubishiElectric# are taking longer, as negotiations over fab integration, R&D resources, and strategic control prove complex.💡More: 🔗

DC POWER UPGRADE FUD: Market weakness begets fear and shortens investor duration, hence tendency to question pie in the sky technology stories. Power transition to 800V seeing some negative press and power names e.g., DELTA $2308; ROHM $6963; $485A; passives in general -- impacted

Some updates on bottleneck timelines: - ABF substrates: 1 year / eg. Ajinomoto (2802) for ABF film, Ibiden, Unimicron, Nan Ya PCB, etc make the substrates - HDI Boards: Over 6 months / Victory Giant (300476), Zhen Ding (4958), Unimicron, Compeq (2313), Meiko (6787) - Multilayer boards: ~6 months / Victory Giant, WUS (002463), $TTMI, Gold Circuit Electronics (2368), - CCL: Over 6 months (severe shortages of materials) / Elite Material (2383), Shengyi (600183), TUC (6274), ITEQ (6213), Nan Ya Plastics (1303), Resonac (4004) Mitsui Kinzoku (5706) / HVLP copper foil. Nittobo / glass fiber/cloth - MLCCs, chip resistors, tantalum capacitors, aluminum electrolytic capacitors: 15-20 weeks to 1 year+ MLCC: Murata (6981), Samsung Electro-Mechanics, TDK (6762), Taiyo Yuden (6976), Yageo (2327), Walsin (2492) Chip Resistors: Yageo, Walsin, KOA (6999), Rohm (6963) and $VSH Tantalum capacitors: Kyocera/AVX, Yageo/KEMET, $VSH again Aluminum electrolytic capacitors: Nippon Chemi-Con (6997) Nichicon (6996) | Timelines sourced from Digitimes, did the honors of adding in related companies. But it's slightly more nuanced since MLCCs and others mix. in commodity types vs. AI DCs. Regardless, just some helpful mapping.