🖥️ NVIDIA Rubin: Four Simultaneous Hardware Overhauls Liquid cooling shifts from premium to baseline. Power architecture moves to 800V HVDC. PCBs scale to 20+ layer HDI with cable-less designs. Copper yields to CPO at the interconnect. Every layer of the AI server stack is changing at once. Inside the Rubin-era hardware and supply chain transition 👉 #TrendForce# #SelectedTopics#

📡 US Export Controls Cover the Whole AI Data Center Stack US export controls now cover the full AI data center stack — from GPU clusters and HBM to optical modules, CPO, and Ethernet switches. Out-of-China capacity and supply chain traceability are entry requirements for North American customers, not differentiators. As supply chains restructure globally, who stands to gain? 👉 #TrendForce# #SelectedTopics#