TrendForce
@trendforce
Founded in 2000, TrendForce is a global provider of market intelligence on technology industries based in Taipei. Also find us on
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✨ MLCC price rebound signals are emerging as AI chip demand tightens high-end supply and squeezes consumer-grade availability, pushing average price declines to a nearly three-year low.💡More analysis from #TrendForce#: 🔗
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🖥️ NVIDIA Rubin: Four Simultaneous Hardware Overhauls
Liquid cooling shifts from premium to baseline. Power architecture moves to 800V HVDC. PCBs scale to 20+ layer HDI with cable-less designs. Copper yields to CPO at the interconnect. Every layer of the AI server stack is changing at once.
Inside the Rubin-era hardware and supply chain transition 👉
#TrendForce# #SelectedTopics#
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💻 The first laptops powered by #Intel’s# “Wildcat Lake” Core Series 300, reportedly built on 18A, are nearing launch. Could they challenge #Apple’s# MacBook Neo in the entry-level PC market?💡More: 🔗
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👀 #TSMC#'s COUPE on Substrate tech is expected to hit mass production in 2H26 — and if #CPO# gains traction in AI servers, #NVIDIA# may look to lock in high-end substrate capacity early via long-term deals. 💡More: 🔗
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👀 YC Chem reportedly became the first to supply #photoresists# for #glasssubstrates#, with the customer moving toward mass production by year-end. Talks with more than three firms are said to be underway. 💡More: 🔗
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Memory prices skyrocketed in 1Q26, as #Samsung# & #SKhynix# officially dropped striking pricing trends in their Q1 reports.
🤔 With attention on the Trump–Xi meeting, trade restrictions are back in focus. #China’s# #rareearth# export value reportedly fell 17% between Apr. 2025 and Mar. 2026. How are supply chains responding? 💡More: 🔗
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📡 US Export Controls Cover the Whole AI Data Center Stack
US export controls now cover the full AI data center stack — from GPU clusters and HBM to optical modules, CPO, and Ethernet switches. Out-of-China capacity and supply chain traceability are entry requirements for North American customers, not differentiators.
As supply chains restructure globally, who stands to gain? 👉
#TrendForce# #SelectedTopics#
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🚨 As #Samsung’s# large-scale strike is set to begin next week on May 21, the company is reportedly moving to cushion the impact with preemptive steps, including a “warm-down” production slowdown and a shift in product mix toward #HBM#.💡More: 🔗
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👀 #TSMC# plans to sell up to 152M Vanguard shares, about an 8.1% stake, as it sharpens focus on core business amid rising capEx — potentially including advanced process, packaging, and global expansion. 💡More: 🔗
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📈 Japanese memory giant #Kioxia# is riding the memory price upswing, with 4QFY26 margins surging to 66%, sharply up from 47% for full-year FY26. The company also expects April-quarter net profit to jump 48x year-on-year to ¥869 billion.💡More: 🔗
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🚀 #Samsung# is reportedly working on next-gen mobile #HBM# packaging using ultra-high-aspect-ratio copper pillars and FOWLP, with bandwidth gains said to reach 15%–30%.💡More: 🔗
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Samsung’s strike is set to formally begin on May 21. Because the company’s semiconductor fabs are already highly automated, the impact on production is expected to be limited. However, there will likely be noticeable disruptions to packaging and logistics, R&D and design, as well as customer relations. In terms of unionization, about half of all employees across the Samsung Group are union members, most of whom work in the semiconductor division. Internally, management has already extended an olive branch to the DRAM division, but has not yet reached an agreement with union members in the Foundry and LSI divisions.
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Samsung Electronics and its union failed to reach a pay deal, raising the risk of a strike that could disrupt chip production. South Korea's prime minister called for more dialogue as authorities monitor the situation to prevent a strike
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Key takeaways of #AppliedMaterials#' latest earnings call: Advanced packaging is emerging as a primary growth driver.
📢 Packaging is emerging as a key growth driver for #AppliedMaterials#, with the company targeting >50% growth in 2026. Semiconductor equipment is also seen rising >30% YoY, supported by strength in memory tools led by DRAM wiring.💡More: 🔗
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👀 #SMIC# saw smartphone-related revenue share fall to 18.9% in Q1, down from 24.2% a year earlier and the lowest since 2021. Are memory headwinds hitting China’s top foundry? 💡More: 🔗
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Japan’s power semiconductor sector is racing to close the gap with Europe—but integration remains a tough challenge.
🚨 Japan’s power semiconductor integration still a long way to go? #Rohm# reportedly says talks with #Toshiba# and #MitsubishiElectric# are taking longer, as negotiations over fab integration, R&D resources, and strategic control prove complex.💡More: 🔗
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🔥Mobile #DRAM# contract prices continue rising in 2Q26. As high prices become the norm, how will smartphone brands offset DRAM cost pressure on product mix?💡More analysis from #TrendForce#: 🔗
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🔥 Amid reports that #Foxconn# may have accelerated #CPO# rack deliveries to #NVIDIA#, the company said at its earnings call that silicon photonics CPO switches remain on track for Q3 mass production, with 2026 shipments expected to hit 10,000 units.💡More: 🔗
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🔥 The U.S. reportedly cleared #NVIDIA# #H200# sales to ~10 Chinese firms including #Alibaba# and #Tencent#, but no chips have shipped yet. Now Jensen Huang is on Trump's China trip. How will this play out? 💡More: 🔗
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🔥 #TSMC# sees the global chip market topping US$1.5T by 2030 and is positioning for a major share, with its #2nm# and A16 chips projected to grow at a 70% CAGR through 2028. 💡More: 🔗
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