TrendForce: GPU lead times are 30–45 weeks, with the upper end of the range up 5 weeks from the previous week. DRAM lead times have shortened to 19 weeks, down 1 week from the previous week. MLCC lead times have extended to 38 weeks, up 3 weeks from the previous week.

TrendForce: - 4Q26 PC DRAM contract price increases confirmed at +13–18% QoQ, moderating from +18–23% in 3Q26. - Most negotiations are expected to conclude in November, with November prices projected to rise slightly further from October. - Notebook shipments fell 14% QoQ in 3Q26 and are forecast to decline another 9% in 4Q26. OEM DRAM inventories rose from 6–9 weeks at the end of 3Q26 to 7–10 weeks in early 4Q26, with further accumulation expected during the quarter. - Weak device sales in Asia and Europe, alongside rising channel inventories in North America, are prompting Tier-2 OEMs to increase white-label models to 15–40% of their 2027 lineup. Adoption of reballed DDR4 paired with Intel Raptor Lake or AMD Picasso is expanding. - Korean suppliers plan to cut PC DRAM shipments by more than 20% YoY in 2027. With the U.S. supplier locking in volumes under SCAs, Korean suppliers are set to deepen their PC DRAM supply cuts to more than 40% YoY, accelerating the shift toward server DRAM.

Trendforce reports 4Q DRAM contract prices are expected to rise about 20% qoq. The projected increase marks a sharp slowdown from 80% in 2Q and 40% in 3Q, reflecting a higher comparison base, weakening end-market purchasing power, and price ceilings under LTAs gradually taking effect, citing Commercial Times

TrendForce sees CapEx from the world’s nine leading CSPs to surge 106% YoY to $957 billion in 2026. In 2027, this figure is expected to surpass $1.5 trillion, representing a further 60% YoY increase. Total server market revenue to surpass $1 trillion for the first time in 2027, while AI server revenue is projected to surge by more than 90% YoY to nearly $920 billion. $DELL $HPE $SMCI $GOOGL $AMZN $META $MSFT

TrendForce now expects combined capital spending by nine major cloud providers to exceed $1.5 trillion in 2027, up 60% year over year. It previously forecast 50% growth. The firm says higher server and component prices are driving up spending. Some suppliers also require advance payments to secure parts, bringing cash outlays forward. It expects AI server shipments to rise nearly 36% in 2027, with revenue growing more than 90% to almost $920 billion, helped by higher average selling prices.

TrendForce maps the companies supplying bonding equipment Hybrid bonding is already used in niche applications. Soon, it’ll take over many facets of advanced packaging $BESI and ASMPT ( have the broadest exposure, with Hanmi (042700.KS) and Hanwha Semitech competing in memory TCB EV Group and Tokyo Electron (8035.T) occupy the wafer-to-wafer bonding side, while Shibaura Mechatronics (6590.T) competes with Besi and ASMPT in die-to-wafer hybrid bonding SUSS ( appears across both hybrid-bonding formats for memory

TrendForce: System-level testing and validation issues persist on the Rubin platform, with volumes expected to ramp gradually from 4Q26 or 1Q27. DRAM Suppliers’ early-stage discussions on 4Q26 contract pricing point to meaningful price increases, suggesting strengthening demand momentum, particularly from US CSPs. NAND (Enterprise SSDs) The DRAM shortage is constraining some NAND suppliers’ ability to support enterprise SSD solutions. As a result, enterprise SSDs are expected to remain undersupplied through 2026. HDD Even though Toshiba announced a new production line expansion, it will take at least 12 to 24 months to come online. Lead times are therefore unlikely to improve before late 2027 at the earliest. ABF Substrates ABF substrate capacity is not coming online fast enough to keep up with the sharp rise in demand. The supply-demand gap is unlikely to close in the near term, so the market should stay tight. ABF substrate prices are expected to rise 10–15% QoQ starting in 3Q26 and continuing through 4Q27. MLCC Demand for low-end consumer-grade MLCCs is slowing, while high-end 0805 standard parts for AI applications are in short supply, extending the polarization in market demand.

TrendForce: HBM > Blended ASP is now projected to jump 121% YoY. > 8-Hi setups are expected to be a priority for evaluation by many GPU and ASIC vendors in 2027. > TrendForce expects 8-Hi products to carry a roughly 10–20% price premium per Gb over 12-Hi products in 2027. > Expects the HBM market to remain supply-constrained in 2027. $MU $RAM $DISK $EWY