TSMC’s Arizona fab posted a Q1 profit of NT$18.8 billion, already surpassing last year’s full-year profit of NT$16.1 billion. Meanwhile, JASM’s Kumamoto fab recorded a NT$900 million profit, marking its first profitable quarter since mass production began at the end of 2024. With advanced process nodes and CoWoS advanced packaging capacity now in severe shortage, TSMC will need to accelerate capacity expansion even more aggressively — even without major price increases — in order to meet customer demand. Under a relatively conservative expansion scenario, overflow orders are already beginning to shift toward Intel and Samsung. $INTC $TSM

TSMC Arizona’s 1st quarter profit beat its entire 2025 profit, media report, at NT$18.81 billion in the quarter, compared to NT$16.14B for all of 2025. -TSMC Japan (JAMC) turned its 1st ever profit, NT$951M in Q1. -ESMC in Germany losses totaled NT$278M. -TSMC received NT$505M in government subsidies from the US, Japan, Germany in the 1st quarter, down from NT$35.15B last year. $TSM #semiconductors#

TSMC is working hard to maintain its lead over Samsung and Intel, media report, by already preparing for 1nm production at Fab 20 in the Hsinchu Science Park with a 4-phase project (each phase is a new production line). -Fab 20 the vital sub-2nm fab. Phase 1 (P1) and P2 will do 2nm, P3 will do 2nm and A14, with room in P4 for A10 (1nm). The project is already in the hands of its R&D ‘One Team’. -Fab 18 P9 (Tainan) will do 2nm back-end and 3/5nm TSV, with equipment move-in in Q1 2027 and scale up to 25,000 wafers-per-month (wpm) -Fab 22 (Kaohsiung) main 2nm fab, 6 phases. P1 & P2 each 25,000wpm, P3 just started equipment move-in for 2nm, A16; P4 under construction, for N2, A16. -Fab 22 (STSP) P7 construction to start early-2027, will do 2nm and below processes. Has reserved space for future P8 and P9. -Fab 25 (CTSP, Taichung) will host 4-phases for A14, A13, A12 processes, with P1 already under construction, with P2 construction to begin soon, and P3 & P4 already in planning. In advanced packaging: -AP6 plant is expected to reach 10,000 wafers per month capacity by the 3rd quarter, and ramp up phase 3 for CoWoS, SoIC and InFO as well. (Hsinchu) -AP5B plant construction nearly finished, will focus on CoWoS (Taichung) -AP7 plant will be TSMC’s biggest advanced packaging campus, with P1 already packaging Apple chips with WMCM (Wafer-Level Multi-Chip Module) P2 nearly done, with equipment move-in in July, for SoIC for Nvidia. Planning for P3-P7 already underway and will support SoIC and CoPoS. (Chiayi) -AP8 will do CoWoS, with monthly capacity to exceed 40,000 wafers by end-2026, and planning for P2, P3 already started. (Tainan) $TSM $INTC $SSNLF #semiconductors# #semiconductor#

Tsé Bitʼaʼí (Ship Rock), New Mexico Two views of one of the most iconic and sacred landmarks in the Southwest. 👀 This is alleged to be a massive volcanic neck rising dramatically from the high desert floor on the Navajo Nation, standing 7,177 feet above sea level. From the distant badlands to the towering close-up of those jagged “sails” —the ship never disappoints. Ancient, powerful, and absolutely breathtaking under that big blue sky.

TSMC , the world's largest contract chipmaker, said on Friday it plans to sell up to 152 million shares in Vanguard International Semiconductor via a block trade to financial institutional investors, cutting its stake in the chipmaker.

Tsinghua University had its RoboMaster debut at 8 PM CST tonight, and their sentry bot showed absolutely insane gimbal stability and total dominance over the arena. #RoboMaster# #Robotic#

👀 #TSMC#'s COUPE on Substrate tech is expected to hit mass production in 2H26 — and if #CPO# gains traction in AI servers, #NVIDIA# may look to lock in high-end substrate capacity early via long-term deals. 💡More: 🔗