Omer Cheema(@Omercheema):At Hot Chips, SK Hynix confirmed hybrid bonding won't hit HBM4E. It's pushed to HBM5 (~2029-30). Not because the tech failed, it's proven since 2010 in image sensors. It's because bonding 16+ memory layers in a row is far harder than bonding one, and a JEDEC height rule just bought more time for the old method. More details here in my article:

Omer Cheema

@Omercheema

Semicon expert. Ex AMD, Ex Samsung. Now at Renesas. PhD Paris Tech. MBA from INSEAD. Opinions my own.

Joined May 2024

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Omer Cheema@Omercheema

2026.08.25 21:16

At Hot Chips, SK Hynix confirmed hybrid bonding won't hit HBM4E. It's pushed to HBM5 (~2029-30). Not because the tech failed, it's proven since 2010 in image sensors. It's because bonding 16+ memory layers in a row is far harder than bonding one, and a JEDEC height rule just bought more time for the old method. More details here in my article: