Trade Whisperer(@TradexWhisperer):$DRAM $MU $SKHY $AVGO Samsung Electronics signed a strategic MOU with Broadcom at the AI Summit in San Francisco to jointly develop next-generation HBM-based AI accelerators. The partnership covers memory and foundry cooperation valued at more than $200 billion through 2030. Samsung will supply HBM (including custom HBM) for Broadcom’s AI accelerators and produce Broadcom chips on 2nm-and-below processes, while also providing advanced packaging and pursuing system-technology co-optimization (STCO).

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Trade Whisperer@TradexWhisperer

2026.07.26 04:31

$DRAM $MU $SKHY $AVGO Samsung Electronics signed a strategic MOU with Broadcom at the AI Summit in San Francisco to jointly develop next-generation HBM-based AI accelerators. The partnership covers memory and foundry cooperation valued at more than $200 billion through 2030. Samsung will supply HBM (including custom HBM) for Broadcom’s AI accelerators and produce Broadcom chips on 2nm-and-below processes, while also providing advanced packaging and pursuing system-technology co-optimization (STCO).