Intel $INTC EMIB Supply Chain Flip-Chip Assembly Bumping Powertech Technology $6239.TW Amkor Technology $AMKR Die Bond ASMPT $0522.HK Kulicke & Soffa $KLIC Laser Marking E&R Engineering $8027.TWO Plasma Cleaning E&R Engineering $8027.TWO EMIB Substrate IC Substrate Ibiden $4062.T Unimicron $3037.TWO AT&S $ATS.VI Shinko ABF Film Lamination Ajinomoto $2802.T Eternal Precision Mechanics $7795.TWO Bridge Die Bond Toray $3402.T Electroplating ASMPT NEXX Laser via Drilling Mitsubishi Electric $6503.T Baking Oven Group Up $6664.TWO Other Components Silicon Capacitor AP Memory $6531.TW Samsung Electro-Mechanics $009150.KS Silicon Capacitor Foundry Powerchip $6770.TW United Microelectronics $UMC Winbond $2344.TW Information derived from Nomura Securities, but I included couple names in the supply chain I believe they missed - AT&S, Ajinomoto