Micron just laid out its AI memory roadmap through 2030.
Token efficiency = Bandwidth + Energy Efficiency + Capacity
• HBM (JEDEC + Custom) → HBM4 to HBM6
• vHBM (Vertical 3D HBM) starts 2028
• vEIM (Vertical Edge Inference Memory) targets 2TB/s & <1pJ/bit
Vertical stacking is coming. Memory wall is real.
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