SemiVision 🇹🇼 👁️👁️(@semivision_tw):At the #ECOC Exhibition, Lumentum, Qualcomm, and Corning Incorporated are demonstrating a high-density optical die-to-die architecture using 1060 nm VCSELs to support high-bandwidth, low-power, and low-latency links over multimode fiber. The demonstration combines Lumentum's VCSEL platform, Qualcomm's D2D interface technology, and Corning's fiber connectivity - showing a practical path toward compact, energy-efficient optical links for next-generation Al systems. Source: $LITE

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SemiVision 🇹🇼 👁️👁️@semivision_tw

2026.09.22 00:43

At the #ECOC# Exhibition, Lumentum, Qualcomm, and Corning Incorporated are demonstrating a high-density optical die-to-die architecture using 1060 nm VCSELs to support high-bandwidth, low-power, and low-latency links over multimode fiber. The demonstration combines Lumentum's VCSEL platform, Qualcomm's D2D interface technology, and Corning's fiber connectivity - showing a practical path toward compact, energy-efficient optical links for next-generation Al systems. Source: $LITE

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