Our U.S. Tour and OCP Global Summit 2026 Takeaways ☕️OCP – System-level inflection
• Decisive shift toward full-stack co-design across hyperscalers
• Nvidia extended networking roadmap new USFP pluggable standard (co-developed with Cisco). Enables 12.8 Tb/s modules
• Showcased PTFE for NVLink Board (inline with our PCB Spec view for 2H27 on Oct 5)
• Microsoft emphasized AI scaling as a system-engineering challenge
• MSFT Unveiled multi-GW Maia 300 deployments from 2027
• Meta maintained pragmatic stance on optics, piloting near-packaged solutions in scale-out domains and Retaining copper for high-density scale-up fabrics ☕️OCP – Optical scale-up and power integration
• Broadcom and OpenAI advanced OCI-MSA multi-rack optical scale-up, highlighted hybrid topologies: high-bandwidth copper for tensor parallelism + optical links for expert parallelism
• GEN2 and GEN3 timelines: 400G in 2027, 800G in early 2030s 
• Google shifted focus to power, positioning datacenters as grid-integrated resources
• 1 GW demand-response capacity with U.S. utilities
• LVDC roadmap: from ±400 VDC Mt Diablo racks to native 800 VDC distribution
• Power engineering now dictates deployment velocity as much as silicon performance
• AMD reinforced CPU-dense trajectory of agentic AI
• Announced Helion CPU racks reaching 32,768 EPYC cores
 🚌 U.S. Tour — Supply Chain and Compute Economics
• No near- to mid-term power-supply risk, Supported by gas-based generation and remote locations 
• Liquid-cooling infrastructure is the bottleneck
• Rack pricing continues to rise (GB300 US$5.5–6.5m; VR200 US$8m), reflecting strong compute demand
• Some believe Inference economics challenging: GPU utilization 20–30%, memory and cooling costs rising
• For agentic AI, model shifts CPU-to-accelerator ratios from 1:4–1:8 to 1:1 → doubling CPU TAM #OCP# #AI# #MSFT# #GOOG# #NVDA# #VR200#