Macro_Lin ｜ 市场观察员
@LinQingV
Ex-quant & PM｜AI chip design｜Semis × Capital Markets｜Not Financial Advice
加入 February 2019
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That was unexpected.
Just in: SK hynix is conducting R&D on 2.5D packaging technology with Intel.
Just in: SK hynix is considering adopting EMIB from Intel.
$INTC
