看起来是有小群的畜生在钓鱼盗号，bsc链上这帮畜生抓100个进去最多1个是无辜的。来历不明的产品要推特第三方登录的时候建议一律停止使用。 有的时候真想给 bsc 这帮畜生都举报逃税让税务进行大抽查

A wallet address was previously created by a former employee, which they then used to generate a token, as part of a video tutorial. That individual is no longer with the company as part of this incident. The individual retained unauthorised access to the associated seed phrase after their departure and used it to generate a new private key. We are now aware that the same address is being used independently in connection with a new meme token. BNB Chain did not create, authorise, promote or participate in the creation of this token and has no control over the token or wallet address. These are not affiliated with or endorsed by BNB Chain. We are pursuing legal action against the former employee and cooperating with relevant authorities on this matter.

这两个月分享交易的方法都是我这么多年总结下来的，如果完全照做的话，6 月大行情可以赚非常多。在这个 7 月，我其实也赚了 20 多个点，还是遇到了这两天回撤的情况，我分享的方法无论大资金、小资金都能复刻，都能去做。而且方法逻辑都写得非常透彻、非常明白，从来不会像天书一样。 但上周我做的一个调查问卷，显示实现像我这样收益的，我看好像没有几个，大多数人还是在一个亏损的状态。 那其实这个时候大家可以去反思一下：其实这个世界上任何事情，道理都非常简单，但能做到的人却非常少。具体的原因到底是什么？

Samsung Electronics Begins Construction of Hybrid Bonding Mass-Production Line at Pyeongtaek P5 Samsung Electronics has begun constructing a die-to-wafer (D2W) hybrid bonding mass-production line at its Pyeongtaek Campus. The line will be used to manufacture next-generation high-bandwidth memory (HBM) and logic semiconductors. According to semiconductor industry sources on the 21st, Samsung Electronics has selected Dutch semiconductor back-end equipment maker BE Semiconductor Industries (Besi) as its preferred supplier and initiated the process of acquiring 50 D2W hybrid bonding machines. The equipment is slated for installation at the P5 fab on its Pyeongtaek Campus. During Besi’s first-quarter earnings conference call in April, CEO Richard Blickman said, “We expect to see something more definitive regarding Samsung Electronics’ adoption of hybrid bonders around the middle of this year.” At the time, Besi’s hybrid bonders were undergoing Samsung’s qualification testing. However, it will take more time to finalize the order. Samsung has requested modifications to the equipment architecture, making it difficult to determine a specific delivery date. Such modifications involve changing certain specifications—such as the design, components, or modules—to meet a customer’s requirements. The fact that Besi’s hybrid bonders cost approximately KRW 6 billion (about $4.3 million) each, roughly twice the price of competing products, is also said to be prolonging negotiations. “Besi supplies hybrid bonders to semiconductor companies worldwide, including TSMC and Micron, and is reluctant to modify the equipment architecture exclusively for Samsung,” an industry source said. “Samsung considers Besi’s equipment the best option, but because coordination has been difficult, it is also considering products from Korean equipment makers that can respond more quickly and flexibly.” SEMES, Samsung Electronics’ semiconductor equipment subsidiary, has also received a request to supply D2W hybrid bonders for the mass-production line. The company hopes to secure orders for two hybrid bonding production lines at the Pyeongtaek Campus. “SEMES felt a strong sense of crisis when Samsung initially selected Besi’s equipment, but the situation has recently begun to change,” another industry source said. SEMES completed development of its D2W hybrid bonder early this year and supplied a unit to Samsung Electronics for performance qualification. This suggests that the equipment has passed the testing process. Samsung is also considering Hanwha Semitech as a hybrid bonder supplier. In February, Hanwha Semitech completed development of its second-generation D2W hybrid bonder, the “SHB2 Nano.” It subsequently supplied an evaluation unit to SK hynix in April. The equipment was delivered as an integrated cluster system combining the bonder with a wafer-handling equipment front-end module (EFEM) from Cymechs, a plasma activation module from Hanwha Semitech, and a cleaning module from ZEUS. Samsung’s construction of a D2W hybrid bonding mass-production line at its Pyeongtaek Campus is related to the packaging processes for HBM and logic semiconductors. According to industry sources, Samsung has pursued a hybrid bonding line for next-generation HBM at its Pyeongtaek Campus in addition to its Cheonan Campus, which serves as a major semiconductor back-end packaging hub. Using hybrid copper bonding (HCB), rather than conventional thermocompression (TC) bonding, to stack HBM core dies (DRAM chips) can significantly improve performance, power consumption, and thermal characteristics. This is because the technology directly bonds copper and dielectric materials without using metal protrusions known as micro-bumps, thereby shortening the interconnect length between devices. The technology is particularly likely to be used for customer-specific, or custom, HBM (cHBM). In cHBM, Samsung replaces the conventional base die with a logic die incorporating the customer’s computing circuitry and intellectual property (IP). This logic die assists external central processing units (CPUs) and graphics processing units (GPUs) with computation while optimizing data transmission. Samsung plans to implement a three-dimensional system-in-package (3D SiP) architecture in which HBM DRAM layers are stacked vertically and directly on top of the logic die. Samsung Electronics’ foundry business also unveiled “3D Cube-H,” a next-generation 3D vertical stacking solution based on hybrid bonding, last month. Designed for next-generation artificial intelligence chips and high-performance computing (HPC) systems, the heterogeneous integration packaging technology offers improved performance, power efficiency, and bandwidth compared with conventional packaging technologies. Samsung Foundry is currently actively proposing the solution to customers for adoption. Hybrid bonders from the equipment suppliers are expected to begin arriving and being installed at the Pyeongtaek Campus toward the end of this year. However, Samsung internally expects large-scale production using hybrid bonding to become feasible around 2030, as the technology is considerably more challenging than TC bonding. “We expect hybrid bonding to enter full-scale use around 2029, when Nvidia’s next-generation AI accelerator, Feynman, is expected to arrive,” a third industry source said.