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Congrats to @MediaTek on the Dimensity 9600 Pro. 🎉 Featuring the Arm C2 CPU cluster with C2-Ultra CPUs and the Mali G2-Ultra NX GPU, the new flagship SoC delivers high performance and power efficiency for faster, more responsive mobile experiences.
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MediaTek says the memory-saving features in its Dimensity 9600 Pro are designed to ease pressure from rising chip and memory costs. The company says these features let phones run larger AI models without additional RAM. According to TechNews, the chip supports mixture-of-experts models with up to 30 billion parameters, keeping roughly 3 billion in memory and loading others as needed.
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MEDIATEK UNVEILS ITS FIRST 2NM SMARTPHONE CHIP MediaTek launched the Dimensity 9600 Pro, its first mobile processor built on TSMC's 2-nanometer process, alongside the 3-nanometer Dimensity 9600M for the broader flagship tier, per Reuters. The first phones using both chips launch soon. The 9600 Pro's neural processing unit handles more generative-AI work on the device and processes a user's prompt 51% faster than the previous generation, the company says. The push is aimed at Qualcomm $QCOM in premium handsets, where MediaTek's market value already passed Qualcomm's earlier this year. MediaTek's first AI accelerator for a major US cloud provider enters mass production in the fourth quarter. Last month it raised $3.9B in a convertible sale in which $NVDA put in $3.5B and $GOOGL participated. August revenue rose 44% y/y.
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Congratulations to vivo on the new vivo X500 Pro Series! 🎉 Powered by @MediaTek Dimensity 9600 Pro, with 2x Arm C2-Ultra + 6x C2-Pro CPU cores and Mali G2-Ultra NX GPU, the X500 Pro brings next-gen performance and efficiency to OriginOS 7 — enabling seamless multitasking, responsive experiences and agentic AI.    With 15% higher CPU performance and 61% lower power consumption, alongside 27% higher peak GPU performance, 24% lower power at peak performance and 18% higher ray-tracing performance. 👏
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MediaTek just launched two flagship phone chips at once. That is a first for it. The Dimensity 9600 Pro is built on TSMC’s 2nm process. The Dimensity 9600M uses TSMC 3nm. Phones with both are due soon. $TSM The Pro is the top chip. It uses an all-big-core design: two ultra cores at 4.55GHz and six more big cores beneath them. Single-core speed is up 17%. Multi-core is up 15%. At peak multi-core load it uses 61% less power than the last generation. On-device AI is the pitch. A second-gen low-power brain uses 40% less energy. A tenth-gen high-power brain makes 55% more tokens per watt. The chip is meant to notice and act, not just sit in an app. The 9600M is the volume flagship. Same idea, lower cost. Better camera processing and a lighter AI agent for more phones. MediaTek says its Dimensity line has been the world’s top phone chip for six years. Two chips at one event is how it tries to keep that. 2nm for the tip. 3nm for the crowd.
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🔔 The Daily Semi-Cap — September 15, 2026 📊 SMH: $542.11 (+0.11%) 📈 Earnings: • No new semiconductor earnings released today. 🔥 Major Developments: • Apple raised prices by $100 on four existing iPhones as Tim Cook described memory costs as a “100-year flood.” The 2TB iPhone 18 Pro Max rose $500 versus its predecessor, underscoring how memory pricing power is flowing through to consumer hardware. • MediaTek unveiled the Dimensity 9600 Pro, its first flagship smartphone processor built on TSMC’s 2nm process. The chip pairs an all-big-core CPU with LPDDR6 support and a dual NPU, pushing leading-edge 2nm silicon and on-device AI into premium Android phones. • YMTC began full-scale equipment hookup at Wuhan Fab 3, keeping initial operations on track for year-end and targeting roughly 100,000 12-inch wafers per month at full capacity. YMTC already reached 14% of global NAND bit shipments in Q2, moving ahead of Kioxia into third place. • A new map of more than 300 U.S. datacenter moratoriums found that while 20GW of planned capacity sits inside restricted local boundaries, only 1.5GW is actually delayed, or 2.3GW including New York’s statewide action. The constraint looks meaningful but far smaller than the headline risk to the broader buildout.
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Google TPU 8t superpod will have 9,600 chips. Native FP4 support
SpaceX President Gwynne Shotwell just revealed the enormous scale of Starlink: “As of June 30th, our constellation of operational Starlink broadband and mobile satellites in orbit grew to roughly 10,200, with our 9,600 broadband satellites delivering roughly 800 terabits per second of total downlink capacity Following a successful speed-run test of the V3 Starlink satellites on the most recent Starship launch...during which we connected every satellite through every laser link.....we intend to deploy V3 satellites into the constellation for operational use on the upcoming Starship missions”
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