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GlobalFoundries’ CHIPS Program award amended to support $5bn investment in Malta, NY, and Burlington, VT. @GlobalFoundries
GlobalFoundries and the U.S. Commerce Dept have finalized a $21B semiconductor deal for Malta, New York: - 2 new fabs funded by Japanese capital - ~27K construction and ecosystem jobs plus 1,000+ manufacturing roles - $955M in CHIPS funding allocated to silicon photonics and packaging - U.S. takes a ~4% equity stake valued at ~$2B In the AI race, raw compute is useless without optical interconnects, these fabs build the silicon photonics needed to stop massive AI data clusters from melting under bandwidth and power bottlenecks.
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GlobalFoundries $GFS has been selected as the technology provider and operator for two planned fabs in Malta, New York, under a U.S.-Japan initiative with up to $21 billion in funding from Japan. About $10 billion will go toward the first 300 mm fab, which is expected to come online in 2029. Once fully operational, it would add capacity for roughly 900,000 wafers a year. GF expects construction to begin later in 2026. A further investment of about $10 billion would fund a second fab with similar capacity.
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GlobalFoundries plans to build two new chip plants with the backing of as much as $21 billion from the Japanese government, part of an arrangement that also includes the US taking a 4% stake in the company.
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GLOBALFOUNDRIES $GFS PLANS TWO NEW CHIP PLANTS IN NEW YORK WITH UP TO $20B FROM JAPAN The US Commerce Department will also take about a 4% stake in the company, per WSJ. - Japan invests about $10B per plant, part of its $550B US investment pledge - Both plants go at its Malta, NY site - The first plant is expected online in 2029 - $955M of its existing CHIPS Act award gets moved to new chip tech
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GLOBALFOUNDRIES GETS $21B TO RUN CHIP PLANTS IN US-JAPAN DEAL
#GlobalFoundries# reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies
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GlobalFoundries shares gained as much as 7% after the chip manufacturer announced a five-year, $2 billion deal to provide US production capacity to Taiwan Semiconductor Manufacturing
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GlobalFoundries $GFS signed a $2B, five-year deal to make silicon interposers for TSMC in New York, the first US source of the AI-packaging component; volume ramp in 1H 2028.