Hanmi Semiconductor is showing a big AI packaging lineup at SEMICON Taiwan. The company is already No.1 in HBM TC bonders and now pushing deeper into 2.5D equipment for AI chips, plus HBM4 tools and a next-gen Wide TC bonder for larger DRAM dies. Hanmi Semiconductor is showcasing five models of 2.5D packaging equipment: FC Bonder 3.5 FC Bonder 75 2.5D TC Bonder 40 C2S 2.5D TC Bonder 40 C2W 2.5D TC Bonder 120 Among these, the FC Bonder 3.5, FC Bonder 75, and 2.5D TC Bonder 40 C2S and C2W have been released sequentially since the end of last year and are being supplied to global foundry and OSAT companies for mass production, while the 2.5D TC Bonder 120 is scheduled for release soon. Hanmi Semiconductor official stated, "Semicon Taiwan is a global event where AI semiconductor technologies converge," adding, "Hanmi Semiconductor will lead the growth of the AI ​​semiconductor market by expanding the supply of advanced packaging equipment not only for its globally leading HBM TC Bonder but also for the AI ​​system semiconductor market." #HanmiSemiconductor# #HBM# #AI# #Semiconductors#

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