HBM4 and HBM4E are expected to nearly triple their share of HBM demand to 48% in 2027 as $NVDA Rubin and next-gen AI chips require a ton more advanced memory. What’s also wild is that HBM3E 8-Hi is expected to double its share to 17% suggesting ASICs are expanding the market and giving $MU and $SKHY more ways to grow across both premium and mature memory.

#Samsung’s# HBM4 Yield Reportedly Reaches 80%: Competition Is Shifting From “Technology Catch-Up” to Volume Expansion South Korea’s Seoul Economic Daily reported on September 20, citing industry sources, that Samsung Electronics’ HBM4 yield has improved from below 60% during the initial mass-production stage to approximately 80%. Samsung is now reportedly planning to increase its overall HBM monthly wafer input from around 180,000 wafers in 2026 to approximately 250,000 wafers in 2027, representing an increase of nearly 40%. The key shift is clear: the HBM4 race is moving beyond technology qualification and yield improvement toward large-scale capacity expansion and customer allocation.

$MU $SKHY $DRAM Wow. HBM4E is now expected to consume about 4x (400%) more wafers per bit than conventional DRAM. Same fab capacity, same wafer starts, but a huge chunk of what used to become DDR is now becoming HBM instead. These are additional clues from Micron's Chief Business Officer at the KeyBanc Tech Forum that there is no end in sight for this DRAM shortage, even with every fab expansion announced. "To produce 100 bits of HBM, we have to reduce 300 bits of DDR supply because there is that 3 to 1 trade ratio between HBM3E and DDR. When you go to HBM4 and HBM4E, that trade ratio has worsened to closer to 4 to 1." So every 100 bits of HBM4E produced costs the industry roughly 400 bits of DDR supply. And HBM bit demand keeps climbing through 2030. Doesn't look like it's a temporary squeeze. Seems like a permanent reallocation of DRAM capacity toward HBM, and the trade ratio only gets worse from here. Structural Shift.

👀 After its HBM4 yield reportedly hit 80%, Samsung is already looking ahead. It is reportedly weighing a shift of NRD-K Line 2 from R&D to foundry use, targeting 2nm HBM base dies for future NVIDIA needs.💡More: 🔗