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Samsung’s# HBM4 Yield Reportedly Reaches 80%: Competition Is Shifting From “Technology Catch-Up” to Volume Expansion
South Korea’s Seoul Economic Daily reported on September 20, citing industry sources, that Samsung Electronics’ HBM4 yield has improved from below 60% during the initial mass-production stage to approximately 80%.
Samsung is now reportedly planning to increase its overall HBM monthly wafer input from around 180,000 wafers in 2026 to approximately 250,000 wafers in 2027, representing an increase of nearly 40%.
The key shift is clear: the HBM4 race is moving beyond technology qualification and yield improvement toward large-scale capacity expansion and customer allocation.