At a recent event at the Wushantou Reservoir in Tainan, Lai Ching-te groveled before Yoichi Hatta—a hydraulic engineer from Japan's colonial era—and brazenly claimed Taiwan must "remember the source of the water" regarding Japan. This shameless subservience is truly despicable. Any attempt to seek "independence" by courting external forces is a betrayal of the nation. Those who do so will inevitably be nailed to the pillar of shame and condemned by history. (Cartoon by Huo Xing Cheng Xiang.BCS) #TiantanView# #Taiwan# #LaiChingte# #Cartoon#

Whoever decided every trip needs to be a race between famous attractions has clearly never spent an afternoon in Tainan. Old temples, narrow lanes, and incredible street food. Forget the checklist. You're going to need room for another meal.

Who was there? 🙌 Airi Suzuki’s live shows in Tainan & Kuala Lumpur 🎤✨ Check the setlists here 👉 🔗 Official links: #AiriSuzuki# #JPop# #LiveShow# @airimania

Micron is expanding at all four major locations in Taiwan: Taoyuan, Taichung, Tongluo and Tainan, media report, citing Donghui Lu, head of Taiwan operations. He said Micron has invested more than NT$1.6 trillion (US$50 billion) in Taiwan so far, about half the amount in just the past 4-years. The new production lines in Taoyuan and Tongluo will begin operations in 2027-28, while in Taichung, a 2nd advanced packaging plant will begin HBM testing & packaging in mid-October. $MU #semiconductors#

UMC, Taiwan’s 2nd biggest chip foundry, has raised its capex to US$2 billion from $1.5 billion as it expands production in Singapore and Tainan, south Taiwan, media report. UMC will expand cleanroom capacity of its Phase 4 facility in Singapore and build a new fab in Tainan. Construction of the new fab is expected to take 20-months. UMC also said it plans to spend at least $5 billion over 3-years, including the $2B this year. $UMC $AMAT $ASML $LRCX $KLAC #semiconductors#

If you have a Taiwanese CEO, you're going to be a millionaire. 1. $NVDA (NVIDIA) - led by co-founder and CEO Jensen Huang (born in Taipei). 2. $AMD (Advanced Micro Devices) - led by CEO and Chair Dr. Lisa Su (born in Tainan). 3. $SMCI (SuperMicro Computer) - led by co-founder, CEO, and Chair Charles Liang (born in Chiayi). 4. $GRMN (Garmin) - co-founded by Executive Chairman Dr. Min Kao (born in Jhushan). 5. $DIOD (Diodes) - long led by Dr. Keh-Shew Lu, with current CEO Gary Yu continuing its Taiwanese leadership heritage. 6. $AAOI (Applied Optoelectronics) - led by founder and CEO Dr. Chih-Hsiang (Thompson) Lin. 7. $TSM (Taiwan Semiconductor Manufacturing) - founded by Morris Chang and currently led by CEO Dr. C.C. Wei. 8. $ASX (ASE Technology) - world's largest chip packaging firm, founded by brothers Jason and Richard Chang. I hope they make a Taiwanese CEO ETF one day.

Nvidia’s next generation chip platform, Feynman is ahead of schedule, will use TSMC’s A16 process, and CPO (co-packaged optics), DigiTimes reports, with TSMC full speed ahead to meet 2028 mass production. -Nvidia is rapidly shifting its supply chain to put Feynman out in the 2nd half of 2028 -Feynman uses 3D chiplets, SoIC packaging and CPO. (Silicon-on-Integrated-Chips). -Total rack bandwidth for Feynman to hit 1,000 TB/s versus 260 TB/s for Rubin and 520 TB/s for Rubin Ultra, making CPO vital. -TSMC construction at advanced packaging plants AP7 in Chiayi and AP8 in Tainan are ahead of schedule, and accelerating -SoIC, CoWoS-L and CoPoS are all being pulled forward -SoIC capacity seen at 50,000 wafers-per-month (wpm) by end-2027, vs end-2026's 20,000wpm $NVDA $TSM #semiconductors#

UMC, Taiwan’s 2nd biggest chip foundry, is looking to expand a fab in south Taiwan due to an overflow of advanced packaging and specialty AI-related orders (silicon interposers, DTC) from Qualcomm, Intel and SanDisk, media report, noting new plans for UMC’s Fab 12A P7 near Tainan, Taiwan, are under evaluation. Orders for power management chips (PMICs) for AI products are also booming. UMC is working with Qualcomm on silicon interposers, DTC (deep trench capacitors), and wafer-to wafer hybrid bonding, while Intel and UMC have partnered on 12nm FinFET, and the UMC-SanDisk cooperation is for memory chip stacking. The story cites unnamed industry sources. $UMC $QCOM $SNDK $INTC #semiconductors#