Some Indian guy really is clueless about semiconductors… he clearly has no idea what he’s talking about. No wonder the Taiwan market bounced back right away today. It’s pretty obvious who’s being delusional here.

$POET and $IREN literally both won the Fake it Until you make it award. -> Grey area endless marketing of crap through influencers. -> Diluted retail enough to hoard tons of cash -> Cash is sets baseline Market Cap. Now $POET probably has around $830M pure cash from dilution after $400m private placement. While their marketcap was sitting under $500m last year.

MssCorp (TWE: 6830) Serenity High Conviction Bet（analysis fully grounded in TSMC’s latest public expansion plans and 2026 industry data）： – this is the functional monopoly in CPO/SiPh inspection (90%+ share targeted, pricing power is real). Long list of customers ($TSM, $NVDA, $AAPL, $AMAT , $LRCX, $ASML , $INTC ) all need to go through them for yields. NVIDIA dedicated AI Chip Zone in US facility = strategic lock-in. -GS CPO TAM still the anchor: $91B by 2028. -TSMC CoWoS doubling to 130k-140k wafers per month by end-2026 via AP7 Chiayi (world’s largest advanced packaging hub, CoPoS pilot 2026/volume ramp 2027-28) + AP8 Tainan (P1/P2) + AP5/AP6 upgrades. We are still in the frontrunning window. Pure TSMC fab expansion model only — no NVIDIA exclusive assumed. Factory-by-factory HG demand: HG is specialized QA/FA tool (not standard per-line gear). Base Assumption~60 units per major packaging “module group” (20 front / 20 mid / 20 back). Using latest TSMC 2026 data: AP6 (Longtan/Taichung): Operating + upgrade → ~30 units / MssCorp 25-30 units AP7 Chiayi: World’s largest, CoPoS pilot → ~45-120 units / MssCorp 40-100 units AP8 Tainan (P1-P2): Construction/ramp → ~120 units/ MssCorp 100-110 units AP8 later phases + AP9: 2028+ planning → ~240-260 units / MssCorp 200-220 units TSMC only total: ~435-530 units / MssCorp 365-460 units Updated HG model (reflecting monopoly + pricing power): Industry total demand 130-200 units 26-30. With 90%+ monopoly → MssCorp ships 120-180 units (spares + repeat buys). ASP NT$60M (pricing power) + GM 60-75%. HG contribution build (NT$ bn, cumulative 2026-2030): Equipment sales + Recurring services/consumables (25–45% of equipment value over 5 years) + IP licensing (20–35% of equipment rev, 80-90% margin). Total HG contribution NT$9.5bn–NT$13bn. Core MA/FA business growing 20-30% CAGR from NT$22B 2025 base on top. Revenue path (NT$ bn): 2026: 30–38 2027: 45–62 2028: 65–88 2029-30+: 180–240/yr (normalized) Mix shifts hard to high-margin equipment + recurring + IP as CPO goes volume Share count 51.78M. With the structural monopoly in a critical yield choke-point + TSMC/NVIDIA tailwinds, long-term normalized forward EPS can realistically reach NT$180–240 (US$5.6–7.5). 40–60x forward P/E (standard for AI/SiPh leaders with real moats) → target NT$5,000+. Current MC ~$1.2–1.4B.

FII Vera Rubin Rumor & CPO Order Upgrade for Shunsin (TWE:6451)： • Unofficial source (FII Earnings Call’s lunch gathering ) claim FII has secured major involvement in NVIDIA’s Vera Rubin platform (August mass production, ~60% share on key components, doubled GB server shipments to ~60k units, and >10k racks). • Taiwanese media (Economic Daily News, May 13) reports Foxconn has begun early CPO full-optical switch shipments to NVIDIA, with targets sharply upgraded to over 50,000 units combined for 2026–2027 (from original ~10k estimate). • Shunsin (TWE:6451), Foxconn group’s key subsidiary for high-speed optical transceiver modules and CPO technology, is positioned in the “optics” segment that FII is reportedly sourcing externally while integrating most other components in-house. • If realized, the elevated CPO volumes could drive increased intra-group demand for Shunsin’s optical interconnect solutions. Conclusion: This combination points to another potential positive development for Shunsin (TWE:6451) within the Foxconn AI supply chain..

Most foreign investors really didn’t realize this…. NVDA’s 50k-unit CPO full-optical switch order is a 50,000 Unit* 100,000 USD/per Unit=5 billion USD PO…. Yet Shunsin ( the critical Foxconn CPO packaging player, has a market cap of only < $2B… #foxconn#, #NVDA#

TSMC 2026 Technology Symposium (Taiwan 5/14) Summary: Global Expansion & Operations · Global Build-out: Constructing or modifying 18 fabs worldwide (includes 5 advanced packaging plants). · Taiwan Core: 12 of these 18 facilities are located in Taiwan. · Acceleration: Expansion speed has doubled to 9 new plants per year (2025–2026) vs. 4 per year (2017–2024). International Site Progress · Arizona (USA): -Fab 1 output to grow 1.8x in 2026. -Fab 2 equipment move-in 2H-2026 (N3 production 2H-2027). -Fab 3 broke ground 1H-2025. -Fab 4 and first advanced packaging plant (AP1) are in initial construction. · Kumamoto (Japan): -Fab 1 (28/22nm) yield already equals Taiwan levels; 2026 output target is 2.3x YoY. -Fab 2 began construction in 2025 for N3 production. · Dresden (Germany): -ESMC facility focusing on 12nm–28nm for Automotive/Industrial. Advanced Process Roadmap (N2 / A14 / A12) · N2 Momentum: Fab 20 (Hsinchu) and Fab 22 (Kaohsiung) are in mass production. Taichung Fab 25 to follow in 2028. · N2 Performance: First-year output expected to be 45% higher than N3's first year. Capacity expansion CAGR of 70% seen 2026–2028. · Yield Maturity: N2 yield learning curve is 2 quarters ahead of N3 at the same stage, driven by AI-optimized manufacturing. · A14 (1.4nm): Already achieved >80% yield on 256Mb SRAM; offers 10–15% speed boost or 25–30% power reduction vs. N2. · New Nodes: -A12 (Performance-focused with Backside Power/Super Power Rail) and A13 both targeting 2029 production. -N2U(enhanced 2nm) slated for 2028. · Next-Gen: CFET architecture reduces SRAM cell area by 30%vs. Nanosheet. Advanced Packaging & Silicon Photonics · CoWoS Scale: 5.5x reticle size now at 98% yield. Scaling to 14x reticle for 20 HBMs by 2028 and 24 HBMs by 2029. · System on Wafer (SoW): Future "Super Exchange" chips to integrate 64 HBMs/16 CoWoS units, exceeding 40x reticle size with 100TB+ bandwidth. · Growth: 3DIC/CoWoS capacity CAGR of >80% 2022–2027. · COUPE: All-optical interconnects to replace copper as data centers scale to millions of GPUs and power needs surge 200x. Specialty & Memory Shift · The Memory Divorce: Shifting from eFlash to RRAM (ReRAM) and MRAM for advanced nodes (≤28nm) in Auto, AI Glasses, and Edge AI. · Edge AI Specs: -N4PRF (RF process) for 39% power reduction -N16HV(16nm High Voltage) specifically for AI Smart Glasses/AR displays. $TSM $NVDA $AAPL $AMD $AVGO $MRVL $INTC $AMZN $GOOGL $MSFT $META #semiconductors# Links:

Nvidia just set up a dedicated zone inside Msscorps ( and locked down 75% of their entire production capacity! Yesterday at the TSMC Technology Forum, Msscorps was back in the spotlight again. Optical inspection demand is exploding exponentially — their monopoly position is only getting stronger. BTW, I told you all to buy yesterday 😉📈🔥 #6830# #Msscorps# #Nvidia# #TSMC#

Market rumors: Finisar optical modules price increase by 15-20%, mirroring the recent surge in memory prices. This once again confirms the logic of this chart. 🚀 ‘’Finisar’’ is a subsidiary of $COHR (Coherent Corp.). The recent price increase in optical modules signals tight supply in the market, which has significantly enhanced the bargaining power of optical module suppliers

MSSCORPS ( is dominating the critical optical loss detection niche for silicon photonics (SiPh) and CPO — patents in TW/JP/US, near-monopoly position (>90% share claimed in core light-loss testing for AI/high-speed optics). SiPh overall TAM is exploding toward ~$8-10B by 2030 (CAGR ~25-29%). The specific test/measurement & optical I/O segment (their sweet spot) is already ~$1.2-1.4B today and projected to hit $2-4B+ in the coming decade with AI data-center/CPO ramp. With equipment sales (MSS HG units up to ~NT$60M each) + services + licensing, this could drive major forward EPS upside as they scale (rough back-of-envelope: meaningful share capture at scale could push rev hundreds of millions USD with high margins → significant multi-fold EPS growth from current base). Stock has pulled back ~25-30% from recent highs (~1,000 → ~720). I’m starting to accumulate gradually — grateful the market gave this entry. (Deeper analysis from sharper accounts like Serenity is far better than mine — no need for me to show off.)

Serenity’s High Conviction Bet: ShunSin ( – Pre-Market Supplement: I have a few quick points to add before the market opens. Hope everyone uses today’s earnings volatility as the perfect chance to get on board! 1. Earnings Loss Interpretation: According to TWSE (Taiwan Stock Exchange) rules, stocks that enter “disposition” must publish monthly financial reports. ShunSin triggered disposition twice in the past two months, so the Q1 loss was already fully disclosed as known information. Even with the known loss, the stock still rose more than 200%. The reason is obvious. For the deeper context, check my earlier post on the subtle implications behind ShunSin’s material announcements clarifying earnings forecasts in the Taiwan market. 2. NVDA 50,000-unit Full-Optical CPO Switch Rerate: Market rumors first claimed ShunSin landed a major Broadcom order that would drive 2026-2027 EPS up 1,200% (credibility of that news can be judged from the latent analysis above). That speculation alone pushed the stock to around NT$500. On top of that, fresh rumors of accelerated NVDA CPO timelines and Foxconn increasing its full-optical CPO switch orders to 50,000 units. Once you understand ShunSin’s critical role in the Foxconn ecosystem, it becomes clear they can essentially capture almost the entire order. Here’s a simple forward EPS valuation model for this piece: 50,000 units× USD10k packaging value = USD500 million additional revenue → 25% gross margin contributes NT$3.925 billion gross profit → After deducting incremental operating expenses (conservative 10%) + 20% tax → contributes approx. NT$1.88 billion after-tax net profit → EPS contribution ≈ NT$16.8 (for 2026-2027 combined, based on 112 million shares outstanding) If we also factor in the existing 800G traditional optical modules plus the Broadcom major order, the overall 2026-2027 EPS outlook points to NT$25–30. Applying a typical 40–60x P/E multiple for Taiwan’s CPO sector, the reasonable target price has enormous upside imagination space. Summary: Earnings misses are often the best time to test real conviction in a stock. Once you truly understand ShunSin’s “full-capture” position for high-end orders in the Foxconn ecosystem, you’ll see why NT$500 is just the starting point of the speculation — not the end. Today’s earnings shakeout is your last easy boarding opportunity before the CPO ramp truly begins! 🚀 #ShunSin# #TWO#.6451 #CPO# #SiliconPhotonics# #NVDA# #Foxconn#

I know some fellow FinX investors were shocked by Msscorp’s (TWE:6830) 20% pullback (a typical shakeout technique by TW market makers). Here is some local insight, building on Serenity’s call with additional contributions from @Leoskie_L. As local TW investors, we are happy to share our insights to help everyone weather this short-term selling pressure. The goal is for everyone to succeed in trading Taiwanese names! 🇹🇼🤝