TSMC $TSM pushed back on a report that it is exploring 3D DRAM at Nvidia's $NVDA request, saying it stays focused on logic chips.
The tech is still years from market viability, even for Micron $MU, Samsung and SK hynix, and would cost TSMC billions.
It could stay in AI memory through HBM base dies and packaging without making DRAM.
TSMC has pushed back on a report that it is exploring 3D DRAM memory production at Nvidia's request, saying it is a pure-play logic foundry and plans to stay one, according to Tom's Hardware.
TSMC is reportedly considering making advanced memory chips itself, at Nvidia's request.
The Information says TSMC is drawing up plans for 3D DRAM, led by Hsu Kuo-chin, the executive overseeing advanced packaging. It could build new fabs or buy an existing one and convert it. Nothing has been decided yet.
TSMC already makes Nvidia's processors. Moving into memory would expand its role in the AI hardware supply chain, where getting enough memory matters just as much as getting enough compute.