Just a semi recap TLDR: - $GLW glass bridge per Morgan Stanley has potential, but hard to displace FAU (like FOCI) in short term - $SPCX Starlink Gen 3 is scaling to 100,000 units (10x prev gen) creating possible capacity constraints for suppliers of switches to CCL. - PCB supply shortages are projected to persist until 2028, and component shortages/price hikes are already forcing ODMs like Inventec to issue conservative H2 shipment - DeepSeek and Zhipu are developing custom ASICs to bypass $NVDA (kinda expected by now). - Anthropic has achieved a $30B ARR and is projected to hit >$1B in Q3 profit. Turns out these frontier labs are more profitable than people think. - US admin pressured $AAPL to source from $INTC, in exchange for tariff exception. Kinda pressuring alignment away from TSM. - $TSM plans a 30x expansion of its Photonic Integrated Circuit (PIC) capacity by 2028, growing from 500 to 25,000 wafers per month - Hanmi Semiconductor is entering the CoWoS packaging equipment market - $NVDA and NTT hosting a conference July 24th to discuss CPO strategies. - 5x general NAND flash price hike this year, market size $489B by next year triggered by RAG/inference. Samsung and SK Hynix make emergency fab investments, NAND equipment suppliers go brrrr. - Gas turbine bottleneck, 40% supply gap accompanied by staggering 5-year delivery cycles (mega-fabs need them for mass production). - AI probe card assembly has hit a severe bottleneck apparently. Which is attempted to by solved with things like Innovation Service's machines. - Nanya, 79.5% gross margins reported, memory go brr. 4x capex for capacity/advanced packaging. - CXMT's STAR Market IPO on July 16, so should bring a lot of attention to memory players in that supply chain. - KYEC $1.4B investment into US for $TSM Arizona output test facilities. Lot of these players like $AMKR and others should go brr in 2028. - $INTC CEO warned last month that helium could hinder the manufacturing costs and delivery times of AI chips - 3D NAND word lines are shifting from Tungsten to Molybdenum starting at the 375-layer node - SambaNova secured JPM for AI inference and raised $1B at an $11B valuation. - HBM prices projections to double in 2027 as $NVDA Rubin platform drives demand. - $MU provides $500 million in funding to support GlobalWafers' US manufacturing capacity - $META 'Iris' will enter mass production in September via $AVGO and TSMC and Meta aims to double computing power to 14GW by 2027. - Largan Precision has secured its first CPO FAU order, mass production slated for middle of next year (kinda indication around Foci and others). - Samsung and SK Hynix have delayed the implementation of hybrid bonding packaging technology for HBM4 apparently - Memory costs (DRAM/NAND) have reached 60% of the BOM for sub-$400 smartphones, causing a severe volume contraction. - SK Hynix successfully rasied $26.5 billion through a Nasdaq ADR - $TSLA issued procurement guidelines requiring suppliers to reach weekly production of 1,000 units by September and double to 2,000-2,500 by year end for its 3rd gen Optimus robot. Apparently Alliance Technology and A-Link may be in this supply chain harmonic reducers and vision lenses? Kinda go through all this stuff every day, but don't wanna be a news reporter so just consolidated stuff I found interesting.

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Hanmi Semiconductor (042700 KS), which makes bonding equipment for HBM production, reported preliminary Q3 revenue of 181.0 billion won, down 27.9% from Q2. Operating profit fell 30.3% to 90.8 billion won. Revenue was up 8.9% from a year earlier, while operating profit rose 33.9%. Operating margin widened to 50.2% from 40.8%. Hanmi said some equipment revenue had been deferred to Q4 and expects a stronger fourth quarter. The company also expects 2026 to deliver a third straight year of record revenue and a new annual high in operating profit.

Hanmi Semiconductor is showing a big AI packaging lineup at SEMICON Taiwan. The company is already No.1 in HBM TC bonders and now pushing deeper into 2.5D equipment for AI chips, plus HBM4 tools and a next-gen Wide TC bonder for larger DRAM dies. Hanmi Semiconductor is showcasing five models of 2.5D packaging equipment: FC Bonder 3.5 FC Bonder 75 2.5D TC Bonder 40 C2S 2.5D TC Bonder 40 C2W 2.5D TC Bonder 120 Among these, the FC Bonder 3.5, FC Bonder 75, and 2.5D TC Bonder 40 C2S and C2W have been released sequentially since the end of last year and are being supplied to global foundry and OSAT companies for mass production, while the 2.5D TC Bonder 120 is scheduled for release soon. Hanmi Semiconductor official stated, "Semicon Taiwan is a global event where AI semiconductor technologies converge," adding, "Hanmi Semiconductor will lead the growth of the AI ​​semiconductor market by expanding the supply of advanced packaging equipment not only for its globally leading HBM TC Bonder but also for the AI ​​system semiconductor market." #HanmiSemiconductor# #HBM# #AI# #Semiconductors#

BREAKING: South Korea’s Hanmi Semiconductor has secured a deal to provide advanced packaging equipment for Terafab’s AI chip production line. It is the first Korean back-end equipment maker to join the supply chain, following HPSP’s front-end equipment order in June.

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