The four plenary keynotes at #
ECOC# 2026 collectively presented a remarkably coherent technology roadmap.
Peter Winzer of Ciena approached the problem from the perspective of AI cluster architecture, examining how the continued expansion of GPU and XPU clusters is forcing optical connectivity closer to compute through scale-up, scale-out, and scale-across architectures.
Patrick Vandenameele, CEO of imec, addressed the same challenge from a semiconductor technology perspective, arguing that future AI scaling can no longer rely on CMOS alone. Silicon photonics, 3D integration, advanced packaging, and electronics will increasingly need to evolve as part of a unified technology platform.