Ben Bajarin(@BenBajarin):Heat is a known issue in HBM, which makes this slide interesting from @SamsungSemiUS as a potential way to handle the increased thermal challenges. I'm also intrigued on the notion that each cHBM base die will not be created equal and performance will likely vary.

Ben Bajarin

@BenBajarin

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Ben Bajarin@BenBajarin

2026.08.24 00:39

Heat is a known issue in HBM, which makes this slide interesting from @SamsungSemiUS as a potential way to handle the increased thermal challenges. I'm also intrigued on the notion that each cHBM base die will not be created equal and performance will likely vary.