Glass Substrates Are Progressing Faster Than Ever
Lately, it's SEMCO that's been pushing commercialization forward
SEMCO has just completed initial reliability testing of its 100 × 100 mm glass substrates and moved to package-level testing using actual customer chips
The company is working with several major global customers
SEMCO targets an operational production line by late 2027 and full-scale manufacturing in 2028
Previous TGV reliability issues delayed equipment orders, making successful package-level validation a critical milestone
It's strongly rumored that $LPK played a key role in resolving these issues, with improvements coming primarily from the development of thicker glass substrates