LIWEI_TW Capital(@LIWEI_TWCapital):$INTC investors: $TSM’s Packaging Constraints Could Open Doors for $INTC’s EMIB-T TrendForce expects CoWoS-L to remain the mainstream AI chip packaging technology through 2028, citing its maturity and yield advantages. But larger interposers raise costs, and $TSM’s capacity constraints are pushing customers to consider $INTC’s alternatives. That gives EMIB-T a potential opening without requiring CoWoS-L to lose its lead. For chip designers adding more compute dies and HBM, packaging availability and cost could make a second supplier increasingly valuable. Sources

2026.09.18 11:55

$INTC investors: $TSM’s Packaging Constraints Could Open Doors for $INTC’s EMIB-T TrendForce expects CoWoS-L to remain the mainstream AI chip packaging technology through 2028, citing its maturity and yield advantages. But larger interposers raise costs, and $TSM’s capacity constraints are pushing customers to consider $INTC’s alternatives. That gives EMIB-T a potential opening without requiring CoWoS-L to lose its lead. For chip designers adding more compute dies and HBM, packaging availability and cost could make a second supplier increasingly valuable. Sources