LIWEI_TW Capital(@LIWEI_TWCapital):$INTC’s glass-substrate patent puts Micro LEDs inside the package🥳🥳 TrendForce reports that the design, originally filed in 2022, embeds semiconductor dies in glass and powers their Micro LEDs through through-glass vias. Proposed uses include internal electrical-test indicators and illuminated lettering on the CPU surface. For $INTC, this describes a way to add lighting and diagnostic functions to chip packaging. The applications described do not establish a high-speed optical data link, so this patent alone should not be treated as a CPO breakthrough or a production announcement. Sources

2026.09.22 03:01

$INTC’s glass-substrate patent puts Micro LEDs inside the package🥳🥳 TrendForce reports that the design, originally filed in 2022, embeds semiconductor dies in glass and powers their Micro LEDs through through-glass vias. Proposed uses include internal electrical-test indicators and illuminated lettering on the CPU surface. For $INTC, this describes a way to add lighting and diagnostic functions to chip packaging. The applications described do not establish a high-speed optical data link, so this patent alone should not be treated as a CPO breakthrough or a production announcement. Sources