Sravan Kundojjala(@SKundojjala):While ASML's low-NA EUV tool shipments grow 30% each in CY27 and CY28, actual industry wafer capacity gains will be 45%+, per ASML. Higher capacity driven by higher mix of tools that have higher wafer throughput. Upgrade packages to existing machines will be incremental.

Sravan Kundojjala

@SKundojjala

Semiconductors, Analyst @SemiAnalysis_ No investment advice. Opinions are mine only.

Joined September 2011

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Sravan Kundojjala@SKundojjala

2026.07.20 16:01

While ASML's low-NA EUV tool shipments grow 30% each in CY27 and CY28, actual industry wafer capacity gains will be 45%+, per ASML. Higher capacity driven by higher mix of tools that have higher wafer throughput. Upgrade packages to existing machines will be incremental.