Shocking, Kirin 9030S is N+2, not N+3….
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Mobile: Pura 90 Pro Max
Die size: 122 mm2
Marker: Hi36D0G-GPCV100
CPP:63nm
Cell height: 252nm
SRAM cell area: 0.0315
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Btw, Kirin 9050 Pro decap is on-going, and it is a chip using N+3 bond with N+2.
Die size is even smaller than Kirin 9030S, hence far smaller than Kirin 9030.