We're gonna win so much!!! We have to keep winning. We have to win more! $INTC advanced packaging momentum is building. Google + Qualcomm → EMIB-T AWS + Microsoft → EMIB-M Advanced packaging is an underrated part of Intel story!!!

The AI money flow in one chart Big Tech spends trillions building SI infrastructure.

NVIDIA sells the picks and shovels. Thats why more than 100% of the free cash flow decline at hyperscalers ends at $NVDA

Goldman on Intel earnings $INTC What is the market really watching? Not the quarter itself. A double beat and raise are nice. Investors want proof that Intel's turnaround is real - Stronger server CPU demand - External foundry wins - Advanced packaging growth - Improving margins

By 2028: HBM becomes one of the largest profit pools in memory. AI servers consume a growing percentage of industry DRAM capacity. Conventional DRAM gets crowded out because more wafers are diverted toward HBM production. $MU $SKHY

Morgan Stanley still expects EMIB-T to remain the primary packaging solution, not be replaced by CoWoS. TSMC is acting as overflow capacity rather than taking the entire opportunity It could scale to support roughly 2.5 million TPU units by 2028, giving Intel an estimated 10-15% share of the advanced 2.5D packaging market. $INTC

The 70% can't generate a single token without the 20%. Compute + networking account for roughly 70% of data center capex. Electrical systems + cooling account for nearly 20%, already more than the cost of the building itself. More powerful AI racks require more electricity and generate more heat. Even if chips get cheaper over time, every new chip still demands more power and cooling. We need more power!!!

Shortage through 2027 is basically confirmed by all major banks But I think UBS overstates how cleanly prices can keep compounding into 2028 without a demand or capacity response

Intel is hunting packaging help outside CoWoS. The latest whisper is AUO and Micro LED glass. $INTC Economic Daily News says it is talking to AUO on Micro LED substrates for co-packaged optics and dense compute chips. Intel would not comment. AUO chair Paul Peng has said the firm is already working with partners on advanced packaging and glass, and would not name them. The reported overlap is glass, through-glass vias, redistribution layers, and light next to the chip. Intel holds a US patent on an IC package with Micro LEDs. The idea is to embed the chip and a glass via in the same glass base so the package can light up, show status, and run optical tests without extra parts. Peng has said AUO is adding trial lines for TGV, RDL, and CPO, plus more Micro LED products this year. Glass antennas for low-earth-orbit satellites are also in the mix. This is still a rumor plus a patent. TSMC remains the volume CoWoS house. Intel is also pushing EMIB for overflow. A panel maker with 30 years of glass is useful. It is not a qualified AI package. If Intel needs glass and light in the same stack, does AUO become a real CPO partner, or just another name on the evaluation list? $TSM

Wafer prices have to rise a lot within two years, or new supply does not get built. China adds capacity. Not enough qualified high-end material to stop 12" utilization running into the high 90s.

One of Russia’s key oil industry facilities and the aggressor’s logistics facility were hit. Ukrainian drones have struck ~90% of Russia’s refining capacity in total and ~73% of that capacity just in August 2026 I will leave the data here without further comment

We are 70% of the way through the year, It's time to start looking at 2027 The most important takeaway isn't how much earnings are expected to grow next year. It's that analysts are still raising their forecasts. Normally, estimates start high and only to get cut over time. This year, they've been moving higher across many different sectors, not just semis. Growth will probably slow down in 2027, but the data so far suggests growth is broadening, not fading. Again, the market doesn't need bad earnings to crash. Earnings can be good, but not good enough for today's standards.