Everyday learn new things! The AI boom is not just more chips. Those chips sit on big, dense circuit boards. The boards are built from a sandwich: glass cloth (the fabric) resin (the glue) copper foil (the wires) That sandwich is called CCL As AI servers get faster, the CCL has to get fancier. Less signal loss, smoother copper, special glass. Those quality steps are the M7 / M8 / M9 / M10 grades. Just like wagyu beef, the higher the number the better, or so I've been told HVLP is the super smooth copper foil those fancy grades need. With that in mind The chart is counting how many factories are actually qualified to make each step. Many exist, but they are just not good enough for Nvidia, Google, AWS etc. They tested the material on a real board for a year-plus and said yes. Ordinary high-speed board materials: a decent crowd (8 laminate makers, 10+ foil makers) Next-gen AI boards: the crowd shrinks (5 and 5) The generation after that: maybe two AI did not create a materials shortage. It created a short list. When only a handful of plants can pass the test, price and mix can stay tight even if the world is full of ordinary circuit board factories. In short, AI is just too picky, it should just work! Come on, just bend the laws of physics