SemiVision 🇹🇼 👁️👁️(@semivision_tw):In May, #AMD announced more than $ 10bn of investment across Taiwan’s ecosystem, with an unusually strong emphasis on advanced packaging. The company identified ASE Technology and SPIL as partners developing and qualifying next-generation wafer-based Elevated Fanout Bridge, or EFB, technology. EFB is intended to provide high-bandwidth die-to-die interconnection while improving power efficiency.

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SemiVision 🇹🇼 👁️👁️@semivision_tw

2026.10.08 06:53

In May, #AMD# announced more than $ 10bn of investment across Taiwan’s ecosystem, with an unusually strong emphasis on advanced packaging. The company identified ASE Technology and SPIL as partners developing and qualifying next-generation wafer-based Elevated Fanout Bridge, or EFB, technology. EFB is intended to provide high-bandwidth die-to-die interconnection while improving power efficiency.