Zephyr(@zephyr_z9 ):Nvidia got FAFOed multiple times with Rubin/Rubin Ultra design - They pushed for higher pin speed HBM4, but Micron's & Hynix's base die were subpar, so they had to change plans & face delays (lower pin speeds) - They pushed for a quad die Rubin Ultra design, yield and warpage issues forced them to switch to 2 die and 2+2 die MCM design - They pushed for 16 Hi HBM4E for Ultra, yield issues forced them to come back down to 12 Hi - They pushed for a dual profile 2.3kW/1.8kW Rubin, but indium-graphite TIM was unstable and now they are switching back to graphite TIM

2026.05.07 16:14

Nvidia got FAFOed multiple times with Rubin/Rubin Ultra design - They pushed for higher pin speed HBM4, but Micron's & Hynix's base die were subpar, so they had to change plans & face delays (lower pin speeds) - They pushed for a quad die Rubin Ultra design, yield and warpage issues forced them to switch to 2 die and 2+2 die MCM design - They pushed for 16 Hi HBM4E for Ultra, yield issues forced them to come back down to 12 Hi - They pushed for a dual profile 2.3kW/1.8kW Rubin, but indium-graphite TIM was unstable and now they are switching back to graphite TIM