MediaTek: $INTC Packaging Yield Issue Identified, Rapid Improvement Expected Once Resolved
MediaTek reaffirmed its Q1 2028 mass-production target for its second-generation data-center AI ASIC, which uses Intel’s EMIB-T packaging.
CEO Rick Tsai said the team has identified key packaging yield issues and is working with Intel and substrate suppliers to implement fixes.
He expects yields to improve rapidly once those fixes are in place.
This is an encouraging sign for Intel: MediaTek continues to commit engineering resources to the EMIB-T program while maintaining its production schedule.
The next milestone is demonstrating that the improvements hold across production lots as volumes increase. A successful ramp would help MediaTek meet customer demand and give Intel a concrete example of EMIB-T delivering at scale, strengthening its case with other potential AI-chip customers.
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