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Chiplet architectures are reshaping semiconductor design.
See how Intel Foundry's EMIB and Foveros advanced packaging technologies help enable high-performance, chiplet-based architectures.
Learn more:
#IntelFoundry# #AdvancedPackaging#
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AI ‘Chipflation’ Washes Ashore in the UK Economy - Bloomberg
Bernstein: AI accelerator chiplet volume to more than double from 2025-2028E.
$NVDA $AVGO $AMD $INTC
Rising power density and chiplet complexity drive thermal considerations earlier in the design process.
#thermal# #datacenters# #multiphysics# #advancedpackaging# #3DIC# #semiconductor#
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Star Wars: Ambush at the Venator
📹 Chip3Dverse
Life is so simple sometimes
Lisa + chiplets = 150X return on $AMD
Foveros 2.5D enables high-density interconnects and heterogeneous chiplet integration, giving designers flexibility to combine different dies, process nodes, and IP in a single package.
Learn more:
#IntelFoundry#
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To me $NAUT is a classic ALC giga-asymmetry
Chiplets for $AMD back in 2014 projected over a decade plus = trillion dollar company
Iterative mapping today for $NAUT is the same deal
Odds of going to zero, but the asymmetry is beautiful
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As AI chips move to stacked, chiplet-based architectures, EDA vendors are reworking mature tools for cross-domain analysis, faster exploration, and agentic AI assistance.
#semiconductor# #semiEDA# #3DIC# #AgenticAI# #chiplets#
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I went long $AMD at $4.20 a decade ago because I believed chiplets would become the foundation of modern compute.
They did.
$IBRX gives me the same feeling today, but in biotech.
Anktiva isn’t just a fusion protein complex. It’s an operating system for the human immune system.
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