Intel Foundry
@Intel_Foundry
A systems foundry for the AI era.
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Arizona is helping shape the future of semiconductor manufacturing. From manufacturing innovation to workforce development, Intel is strengthening the semiconductor ecosystem and supporting local communities.
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As chips get smaller, innovation requires more than simply shrinking transistors.
From planar transistors to FinFETs and gate-all-around architectures, bringing these technologies to life relies on extraordinary manufacturing precision.
Explore the engineering behind these innovations and see what's next for semiconductor technology in our full conversation on @dwarkeshpodcast:
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Advancing semiconductor performance isn't just about smaller transistors.
Innovations in advanced packaging, like hybrid bonding, enable denser chip-to-chip connections and create new opportunities for performance and power efficiency. But bringing these technologies to life requires extraordinary manufacturing precision.
Discover the engineering behind next-generation semiconductor packaging.
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What does it really take to make the world's most advanced chips?
Thousands of intricate manufacturing steps. Extraordinary engineering precision. And an industry working to meet growing global demand for computing.
Get an inside look at Intel's semiconductor innovation as Chris Auth, Pushkar Ranade, and other Intel experts join @dwarkeshpodcast to explore the science, technology, and manufacturing expertise behind advanced chips.
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We’re raising the roof on the first fab in Ohio.
The initial major structural truss is going up at the Intel Ohio site, marking another step toward strengthening U.S. semiconductor manufacturing leadership.
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Building semiconductor leadership requires both innovation and the manufacturing capacity to bring it to scale.
In his latest piece, Naga Chandrasekaran highlights Intel Foundry’s growing U.S. footprint, including progress on our Ohio site.
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AI needs faster, more efficient connectivity. Co-packaged optics (CPO) brings optics closer to compute, but scaling it reliably takes advances in manufacturing and packaging. At #SEMICONWest#, Intel Foundry highlighted the collaboration needed to scale CPO for AI infrastructure.
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The future of semiconductor manufacturing depends on connected intelligence. Explore how metrology, AI, automation, and advanced packaging strategies can work together to improve yield, efficiency, and manufacturing autonomy.
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From idea to innovation, every chip starts with a vision.
With Intel Foundry, the possibilities are yours for the making.
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Semiconductor innovation takes an ecosystem. At #SEMICONWest#, Intel Foundry experts shared how advances in packaging, materials, metrology, and AI-enabled insights are helping bring innovation to scale with the quality and consistency that customers demand.
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Foveros 2.5D enables high-density interconnects and heterogeneous chiplet integration, giving designers flexibility to combine different dies, process nodes, and IP in a single package.
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PDKs connect advanced process technology to the design flow.
Learn how Intel Foundry and @Synopsys are collaborating to bring innovations like PowerVia into customer designs and accelerate adoption of advanced nodes:
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American innovation has helped shape the semiconductor industry for decades.
From R&D to leading-edge manufacturing, Intel Foundry is investing in technology and capacity in the U.S. while helping build a more resilient semiconductor ecosystem.
See how we’re helping build what’s next:
#IntelFoundry# #NationalManufacturingWeek#
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Advancing semiconductor innovation in Oregon.
Congratulations to @LamResearch on its new Tualatin R&D lab. We look forward to building on our decades-long collaboration to accelerate process development for the AI era.
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Hello from New Mexico, where Intel Foundry is reaching new heights.
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At #SEMICONWest#, Lalitha Immaneni, VP of Semiconductor Research and Development at Intel, will discuss the future of advanced packaging during the CEO Summit Keynote.
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Arizona is helping shape the future of semiconductor manufacturing.
At Intel Foundry in Chandler, we're bringing leading-edge manufacturing to Arizona, with Intel 18A now being manufactured at the site.
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#IntelFoundry# #NationalManufacturingWeek#
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Intel Foundry and @Applied4Tech are collaborating on transistor, interconnect, and advanced packaging innovations for AI computing, connecting R&D at Applied’s EPIC Center in Silicon Valley and Intel’s Oregon campus to accelerate the lab-to-fab pipeline in the U.S.
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As compute demands rise, efficient power delivery becomes more complex. In part 2 of our power delivery series, explore how Intel Foundry is advancing technologies that help improve power integrity, efficiency, and scalability.
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Every breakthrough starts with integration.
Intel Foundry brings together silicon design, leading-edge process technology, and advanced packaging to help enable what's next.
Yours for the making.
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