The memory chip boom now has a weekly income ETF. Here is what the Tuttle Capital Memory Stack Income Blast ETF $DRMP holds: - Roundhill Memory ETF $DRAM - Lam Research $LRCX - Western Digital $WDC - Applied Materials $AMAT - Onto Innovation $ONTO - Rambus $RMBS - Amkor Technology $AMKR - Silicon Motion $SIMO - FormFactor $FORM - Penguin Solutions $PENG These are the companies behind DRAM, NAND, and HBM memory, plus the equipment, testing, and packaging that builds it. $DRMP is an income ETF that holds Treasury bills as collateral and sells options on the memory and storage chip supply chain to generate weekly income. Launch: June 10, 2026 Total Assets: $2.58M Expense Ratio: 0.95% Distribution Frequency: Weekly

Earnings Takeaways Note - FORM * 2Q26 beat across the board: Revenue $258.2M and 53.3% GM exceeded expectations * 3Q26 guided to ~$270M revenue with margins expanding to 54%. * AI recovery gaining traction: AI probe card share continues to rise, with stronger CPU and CPO demand supporting the next growth leg. * Rubin & Intel are key catalysts: Expect 10%+ share on Nvidia Rubin, further gains with Rubin Ultra/Humusfish, while Intel’s 18A ramp drives server CPU probe card demand and 20–30% pricing upside from node migration. * HBM to reaccelerate: Memory mix shifts toward DDR in 3Q26, but HBM revenue is expected to reach a record high in 4Q26 with next-gen AI platform ramps. * CPO momentum accelerating: Management expects CPO revenue to hit the high end of FY26 guidance by 3Q26, driven by Triton adoption and insertion leadership. * Valuation: Shares have corrected 38% from the peak and now trade at 25x 2027E P/E (vs. 33x/42x for MPI/Technoprobe), offering an attractive risk/reward. #FORM# #Formfactor#

Spent the last few days talking with optics folks and sitting through conference talks, industry side included. As AI models advance, hardware keeps picking up more of the upside. The evidence is simple — related government and private funding programs have exploded. More funding = a bigger industry. And that naturally pulls more students into the field. Not just Korea, the US is the same story. And once the industry grows and funding ramps, equipment orders follow. But with SiPh, it's not just any equipment that ramps. The layers where an optical dimension gets added tighten first. To play the SiPh ramp, you have to know the equipment stack. Purity of the SiPh signal rises as you go down the stack. L0. Front-end fab — litho/depo/etch $ASML, $AMAT, $LRCX, $KLAC. Biggest dollars, but photonics just rides on CMOS demand. Weak as a standalone SiPh signal. L1. Wafer-level optical + electrical probing — the real bottleneck. Coupling light into the wafer while probing electrically at the same time. FormFactor $FORM (CM300 + probe card, grating-coupler alignment). Optical alignment speed is the rate-limiting step for volume ramp. L2. Parametric / metrology layer — tunable lasers, OPM, LCA, high-speed BERT/scope for EAM/modulator bandwidth. Keysight-centric $KEYS, with Viavi $VIAV/EXFO/Anritsu alongside. L3. Burn-in / KGD / reliability — $AEHR (WaferPak/FOX). Once you go CPO, you can't let a single bad optical die into a multi-chip package, so KGD becomes mandatory. L4. Packaging / final / system-level ATE — fiber attach, optical packaging, and when volume hits, $KEYS/Advantest $ATEYY/ $TER. The bottlenecks sit at L1 (optical alignment) and L3 (KGD). The moment AI forces CPO, those two layers tighten first — and once volume breaks out, the ATE above gets pulled in next.

TESLA’S NEXT-GEN OPTIMUS V3 HAND IS GETTING CLOSE TO HUMAN-LEVEL Tesla engineers just shared new details on the Optimus V3 hand — and the progress is striking. They’re now saying that as they move into Gen-3 and mass production, the hand is getting very close to human functionality and form factor. One engineer described it clearly: “It won’t even look like a robot. It will look like a human in a superhero suit. It will be something revolutionary.” This level of dexterity and human-like design is a critical milestone. The hand is one of the hardest parts of building a truly useful humanoid robot — and Tesla is iterating extremely fast.

"This juggernaut of a machine can be a gateway to AI productivity, with plenty of power and playbooks to get you started." — @ITPro The Dell Pro Max with GB10 is designed to help AI practitioners, developers and data scientists unlock powerful local AI capabilities in a compact desktop form factor. Read ITPro's full review:

👀 Supermicro SYS-112D-36C-FN3P review Featuring the 36-core @intel Xeon® 6 SoC 6553P-B processor, this edge server packs big performance in a small package. With a short-depth, 1U form factor, high-speed connectivity, and integrated accelerators, it's perfect for distributed deployments. Read @ServeTheHome's full review to learn more:

SanDisk is set to launch its new 320 and 520 SATA SSDs, giving consumers more affordable storage options at a time when SSD prices remain high. The new drives will be available in capacities of up to 4TB and use the widely supported 2.5-inch SATA form factor. Although SATA SSDs are slower than modern NVMe drives, they still offer excellent performance for everyday tasks