Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”

Intel's Core i9-14900KF has set a new all-time CPU frequency world record at 9.206 GHz. The record was achieved by Chinese extreme overclocker wytiwx and validated on HWBOT. The run used liquid helium cooling on an ASUS ROG Maximus Z790 Apex motherboard, with only the performance cores active during the single-core validation in CPU-Z. This breaks the previous record of approximately 9.13 GHz on the same processor family and marks the first time any CPU has officially crossed the 9.2 GHz mark. For context, the chip’s stock maximum turbo frequency is around 6 GHz.

Intel Stock continues to rise. I’m very proud of that Company in that I am responsible for making the United States of America over 30 Billion Dollars in the last 90 days on that stock alone. There are others that, likewise, I have been very successful with by taking pieces of the Equity for support. Congratulations to Intel on doing such a great job and, more importantly, congratulations to the People of the United States for making such a good investment! President DONALD J. TRUMP ( TS: Apr 29 2026, 6:20 PM ET )

📈 #Intel#'s #EMIB-T# is gaining momentum. #PSMC# reportedly secures exclusive supply of key silicon capacitors, while #UMC# sees strong silicon bridge demand. How far can the ecosystem expand? 💡More: 🔗

Intel CEO Lip-Bu Tan sat down with CNBC’s Jim Cramer to talk about Apple; Intel 14A rivaling TSMC's top chip production technology; Shortages of CPUs and substrates; and the state of Intel's turnaround. How to know when Intel signs Apple or other foundry customers: Intel CEO Lip-Bu Tan: “Over time, the IP will be ready so we can serve some of these customers. I think the best indication, when you see I increase my capex, I’m putting money to buy equipment, that means I have real customers. That’s the discipline I have.” Intel 14A manufacturing process and EMIB-T advanced packaging: Intel CEO: “(A14) is 1.4nm, this is the most advanced. To be candid with you, in 2028 we will have risk production. 2029 will be volume production. It will be the same time as TSMC. So that is a major, major breakthrough, and I’m so excited. And we already have multiple customers engaged with us, and we have 0.5 PDK available.” Taking advantage of TSMC’s CoWoS shortage Intel CEO: “Our technology is called EMIB-T, this is the next generation of advanced packaging. We really have the best technology and now we are making sure we can bring it into volume production with reliable yield so the customer can count on us.” CEO: “You know, CoWoS…(TSMC) ran out of capacity, so in a way we’ve become in the unique position to support that and that’s something we are very excited (about).” Shortages of CPUs and Substrates CEO on the CPU shortage: “I’ll give you one example. I had one customer say Lip Bu, we gave you the forecast for this year, but we want to increase 3x, and I say I cannot do it overnight but give me a few quarters and I will catch up. So, I think this demand is not short term, it’s the next couple of years. It’s a great opportunity.” CEO: “Right now, as I mentioned, CPU is in high demand. And that’s good for me. I cannot even ship enough to the customer. It used to be the CPU to GPU ratio for training was 1-to-8. And now, because of inference and agentic AI, and more agents you have to manage, and orchestration, and reinforced learning, CPU is actually better, so that becomes 1-to-4 and 1-to-1 and some people even talk about 4-to1, and so that’s a huge opportunity to me to drive the CPU....” CEO on Substrates: “A couple of customers have prepaid for substrates, because the substrate supply chain is very tight – so I need to put up the money to secure this material…(and it shows) the commitment to me – so that’s very exciting.” Intel’s Turnaround CEO: “We used to have leadership in data center, and over the years we lost it…We made some big mistakes,” he said, adding he’s brought back some talent to refocus the product lines and that “Coral Rapids will have multi-threading, and will come out very strong.” CEO: “When I took over, the 18A yield was not good, so I had to ask some of the ecosystem partners to help me look at the data, see how to improve. The best practice is to see 7% or 8% yield improvement per month, and now I’m seeing it.” CEO: “The other part is supposed to be the yield performance, defect density, you know at the end of the year to see the target. Now I see that even before the end of the year – so that is very big encouragement for me and also that’s why Panther Lake can be shipped in volume now. And now some customers knock on my door and say Lip Bu, now we hear you are making great progress, can you now open up to outside customers? So that is very exciting. It’s a lot of hard work, it’s a lot of teamwork, it’s a lot of talent I’ve brought on board.” CEO: “In the past we made a lot of mistakes and now we correct the mistake and we’ve simplified the roadmap. By the way, from Day 1 I came on board as the CEO, I have all the engineers report to me so I have an understanding, hear from the customer, and know where are the mistakes.” Cramer: “They didn’t report to the previous CEO?” CEO: “No. And in a way, they had too many silos, too many people reporting…So I decided, the best thing is to really understand where the problem is, so I can focus on the engineering, how to redesign, simplify the product and then get the real killer products out.” Cramer asks about China, Taiwan and the importance of US manufacturing: CEO: “I was very glad for President Trump understanding the strategic importance for the United States to have (chip manufacturing supply chain) and their support is so valuable to me – it’s so critical for the country to have the technology, R&D development, manufacturing in the United States. That’s why I came back in, as a U.S. citizen – as a calling – to do that.” CEO: “From time to time I update President Trump and also (Sec.) Howard Lutnick and they are big supporters of me and we are delighted to have their support.” Going forward: CEO: “I recruited some key talent…and now, by the end of June, I will have my team, what I consider my team, so that we can work on the next 5-years, 10-years, how to become a different company. I call it the New Intel, work at the speed of light, work as a team to progress forward.” $INTC $TSM #Samsung# $UMC $GFS #semiconductors#

US intel secretly flagged major 2020 election vulnerabilities, including voter data, memo: (TS: 21 Apr 23:17 ET)​​​‍​​‌‍​​‌‍​​​​​​​‌‍​​​​​‌‍​​​​​‌‍​​​​​​​‌‍​​‌‍​​​​​​​​​​‌‍​​‌‍​​​​​​​​​​‌‍​​​​​‌‍​‌‍​​​​​​​​​‌‍​​‌‍​​‌‍​​​​‌‍​​​​​​​​‌‍

Seok-Hee Lee joins Intel as EVP, @Intel_Foundry, to lead advanced packaging and back-end manufacturing, strengthening our ability to deliver system-level innovation. Naga Chandrasekaran will continue to lead front-end technology development, manufacturing, design enablement, and the end-to-end customer and business-facing functions that support foundry’s growth. Navid Shahriari will retire after 37 years at Intel. His contributions helped advance Intel’s back-end technology leadership. Learn more: