As chips get smaller, innovation requires more than simply shrinking transistors.​ From planar transistors to FinFETs and gate-all-around architectures, bringing these technologies to life relies on extraordinary manufacturing precision. Explore the engineering behind these innovations and see what's next for semiconductor technology in our full conversation on @dwarkeshpodcast:

Intel and @OracleCloud announced plans to expand Intel Xeon-based computing on Oracle Cloud Infrastructure. Intended to meet growing demand for enterprise applications, agentic AI and inference, the planned multiyear collaboration is expected to span current and future Xeon platforms, including planned OCI X14 offerings based on next-gen Intel Xeon, codenamed Diamond Rapids. Read more:

Intel announced it has entered into an agreement to acquire @ClassiqTech to advance scalable quantum computing. Combining Intel’s quantum software platform, silicon spin-qubit technology and advanced manufacturing expertise with Classiq’s automated quantum algorithm synthesis platform to help create a full-stack quantum computing platform, while continuing to support a modality-and hardware-agnostic software solution that enables an open and collaborative quantum software ecosystem -

Advancing semiconductor performance isn't just about smaller transistors. Innovations in advanced packaging, like hybrid bonding, enable denser chip-to-chip connections and create new opportunities for performance and power efficiency. But bringing these technologies to life requires extraordinary manufacturing precision. Discover the engineering behind next-generation semiconductor packaging. Watch the full conversation: #IntelFoundry#

Security is evolving. So are the technologies that protect our data. Learn how Intel is advancing trusted computing through innovations in confidential AI, post-quantum cryptography, and more. Read the full 2026 report:

I spent two days touring Intel’s most advanced fab and talking to its technical leadership to understand what the chips of the future will look like. A lot of what's coming next – gate-all-around transistors, backside power, CFET, hybrid bonding – is hard to follow without actually seeing it, so we made all the awesome animated explainers that I wish I had while I was prepping. I also asked Intel’s leadership how the semiconductor industry will cope with the enormous shock in demand from AI. AI compute has grown 3x a year for the last decade, but according to Intel's CTO, Intel could only double leading-edge wafer production with today’s global stock of chipmaking tools. What kinds of tricks can foundries pull to extend this crossover point where demand surges way ahead of supply? This was a totally new format for us - hope you enjoy! 0:00:00 – Intro 0:00:47 – How Intel brings up a new process node 0:03:22 – What Intel learned from 10nm 0:06:28 – From planar transistors to gate-all-around 0:13:13 – Why High-NA EUV pays off for Intel but not TSMC 0:19:20 – Could chips have evolved completely differently? 0:23:33 – Inside Intel's "Hot Topics" meeting 0:29:30 – Replacing copper wires with ruthenium 0:32:41 – Why stacked transistors take a decade to ship 0:39:45 – Hybrid bonding and the chip-to-chip bottleneck 0:48:00 – There aren't enough tools to 10x chip production 0:53:14 – Can Intel catch up to TSMC? 1:01:02 – Terafab, and rethinking the fab from scratch

What does it really take to make the world's most advanced chips? Thousands of intricate manufacturing steps. Extraordinary engineering precision. And an industry working to meet growing global demand for computing. Get an inside look at Intel's semiconductor innovation as Chris Auth, Pushkar Ranade, and other Intel experts join @dwarkeshpodcast to explore the science, technology, and manufacturing expertise behind advanced chips. Watch the full conversation:

Building semiconductor leadership requires innovation and the manufacturing capacity to bring it to scale. In a new piece, Naga Chandrasekaran shares how Intel Foundry is expanding that capacity across the U.S., including progress on our Ohio site, where the initial major structural truss has been installed on first fab. Read more:

Mission-critical environments demand mission-ready technology. See how Intel powers real-time AI, ruggedized edge computing, and secure, scalable solutions for aerospace and defense at AUSA 2026. Learn more:

Excited to announce the appointment of Shesha Krishnapura as an independent member of Supermicro's Board of Directors, effective as of October 9, 2026! Learn more: #AILeadership# #DataCenter# #Innovation# #Supermicro#

Advancing semiconductor innovation requires deep collaboration across the ecosystem. Proud to see @Intel_Foundry and @Applied4Tech working together to accelerate the next generation of AI-enabled technologies.

Software security is no longer enough. @Dell Pro PCs with Intel Core Ultra and Intel vPro offer hardware-rooted protections. Secure your business, manage your fleet, and protect your data with trusted technology partners.