🖥️ NVIDIA Rubin: Four Simultaneous Hardware Overhauls Liquid cooling shifts from premium to baseline. Power architecture moves to 800V HVDC. PCBs scale to 20+ layer HDI with cable-less designs. Copper yields to CPO at the interconnect. Every layer of the AI server stack is changing at once. Inside the Rubin-era hardware and supply chain transition 👉 #TrendForce# #SelectedTopics#

🔥Iran-linked disruptions are reportedly pushing key industrial resin ingredients up more than 40% since March, continuing to pressure #CCL# prices — a critical material for #AI# #GPU# and ASIC #PCBs#.💡More: 🔗