PCBs are the bedrock of modern electronics. You need them everywhere, but AI is now driving PCB demand to a new level. I saw this full process diagram from design to cutting/inner, lamination, drilling, plating, soldering & testing. I posted just drilling steps to show how demanding the mechanical & laser drilling can be for especially the high density, multi-layer PCBs that are now required on these high speed interconnects. I'm not going to bother posting all of these photos. You can do your own research. But my pt is that many modern industries really on complex supply chain & advanced tooling. Supply/demand crunch in one part of supply chain will affect the entire industry. Hence, the AI build out itself is now dependent not on GPUs, but other part of supply chain. PCBs themselves could depend on chemicals from SABIC that have seen supply disruption. The global hydrocarbon is similarly complex (probably more). Where shortage in upstream crude could affect prices, but also many other steps in between that could also face supply/demand issues. There is a lot more than just crude supply that affects your diesel or gasoline px.

PCB: Content Upside & PTFE Adoption Following our very early PTFE note on June 2, we provide update: • Nvidia Rubin platform a major catalyst for PCB content expansion
GB300 → ~US$440/GPU
VR200 → ~US$750/GPU
VR300 → US$1,000–1,500/GPU • Drivers: higher-end CCL materials, rising layer counts, and potential PTFE adoption into Rubin Ultra • VR200 upgrades
Compute tray: M8 + M6 CCL
Switch tray + new 44L midplane: M8.5 (Low-DK2/HVLP4)
→ Content rises to ~US$750 per GPU • VR300 further upside: M8.5 + M6 hybrid compute + M9 (Q-glass) switch/midplane → ~US$1,000/GPU
Oberon NVL576: hybrid PTFE switch boards (16+16L) under evaluation
If PTFE adopted → content could exceed US$1,500 per GPU • Stock preference
PCB: ZDT (4958 TT Buy) – new position in VR200 compute tray
PTFE CCL: Leading Chinese player primary; Taiflex (8039 TT) as potential second source #PCB# #PTFE# #EMC# #TAIFLEX# #CCL#

The PCB/Substrate capacity build is happening fast. Over the past week, Zhen Ding ($4958.TW) has announced a combined USD $110m in equipment orders from TAKEWIN INTERNATIONAL(HK)LIMITED, AMPOC FAR-EAST CO. and $KLAC.

What does a PCB engineer look for when your Gerber files arrive? This graphic breaks down 25 common DFM checks performed before fabrication. 🔍 Trace width and spacing, annular rings, solder mask, board-edge clearance, panelization, materials, surface finishes, and manufacturing files can all affect whether a PCB can be fabricated as intended. At Seeed Fusion, these details are reviewed before production. If a potential manufacturability issue is found, the team contacts the customer for clarification or confirmation before the order proceeds. The exact checks depend on the board design and manufacturing requirements. Quality control starts before fabrication. 🔗 Explore PCB/PCBA manufacturing options and upload your Gerber files👉: #SeeedFusion# #PCBDesign# #DFM# #PCBManufacturing#

From BOM to PCBA, keep component sourcing and assembly with one manufacturing partner. 🔧 Seeed Fusion finds purchasing options, checks availability and lead times, and coordinates parts for assembly—reducing the supplier follow-up and parts-shipping work your team handles. Explore how sourcing support fits into your PCBA project: #SeeedFusion# #PCBA# #ComponentSourcing#

Only three PCB makers currently meet the requirements for 3.2T optical module boards, according to an industry source cited by DIGITIMES: Zhen Ding Tech (4958 TT), Unimicron (3037 TT) and Shennan Circuits (002916 CH). The modules are expected to begin shipping in 2028. Their boards require line widths and spacing of 10 to 15 microns, which could push production from mSAP to the more complex SAP process. Suppliers also need FC-BGA substrate capacity. More suppliers, including Compeq (2313 TT), can handle mSAP, which supports line widths and spacing of 12 to 25 microns. Boards for 1.6T modules already require mSAP and M8 laminates, while M9 is planned for 3.2T boards. The ramp-up is expected to overlap with the IC substrate shortage. Module makers that don’t reserve capacity early could end up competing with AI and HPC chipmakers for production slots.