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Chips & Wafers
@ChipsandWafers
Reliable source for actionable semiconductor data. Let the data guide your decision making process. Now part of @SemiAnalysis_
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But no one cared about substrates until this year ;)
Broadcom's partnership with Toppan was announced in March 2024.
The new Chipbook marketing page is up and running! Check it out:
Positive sign for MJC ($6871.TYO) who makes the probe cards for Samsung HBM chips:
Leeno is losing customers due to a labor strike, and advising customers to seek alternative sources. "It is understood that orders have already been transferred to competitors such as Japan's Yamaichi and Yokowo, and Taiwan's Winway."
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An underappreciated #ABFsubstrate# name is the Japanese company Toppan ($7911.TYO). The real profitability story here is somewhat masked (pun intended) by the photomask business they recently spun off. And this comment from $AVGO yesterday is definitely a positive sign.
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Hanmi Semiconductor (042700 KS) won a double-digit order for 2.5D packaging bonders from a Taiwanese foundry, according to ET News. The tools passed mass-production qualification and are now being deployed. Hanmi is expanding beyond HBM TC bonders into 2.5D packaging for AI processors.
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For years, Nanya PCB has avoided LTA's. Specifically, they have avoided $INTC business for this reason. And just like in the last cycle, avoiding LTA's mean they have greater upside to raise prices relative to peers during supply crunches.
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南電受惠AI需求,大陸PCB廠稼動率逐步滿載,先前因無長約已調漲報價反映成本。 BT載板原物料漲勢趨緩,第4季無意再漲,但報價仍處季節高檔;ABF載板因T-glass等材料持續吃緊,仍有漲價空間。法人看好昆山廠Q4稼動率有望達100%、良率提升,加上PCB與ABF價格上揚,下半年獲利與毛利率可望持續改善。 南電因未簽LTA,調價彈性優於同業,先前漲幅已較高。
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Test consumables are just getting started:
Semiconductor testing firms WinWay and Chunghwa Precision both plan to speed up capacity expansion amid strong AI chip-testing demand, media report, with WinWay expanding socket capacity 50% by the 3rd quarter 2027, and Chunghwa Precision also 50% by March 2027. WinWay also said it currently has over a dozen Co-Packaged Optics (CPO) projects, which are more complex than AI chip testing projects. Production of small CPO volumes are expected to start in the 2nd half of 2027.
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Nanya's ~$84M order disclosure from SCREEN yesterday takes total QTD orders to ~$1.89B, already ahead of Q2's ~$1.8B total with a month still to go. YTD orders are at ~$4.4B.
Singapore has increased their Substrate imports as they ramp packaging capacity. But want's most interesting is where all those substrates are coming from - Malaysia. $ATS.VIE $222800.KQ
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Chipbook subscribers have been watching the wire bonder story unfold since May, when we first noted, "While front-end demand has moderated, we are beginning to observe improving activity across portions of the back-end ecosystem, particularly in wire bonders".
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ABF substrate supply is tight, and key suppliers are looking to expand capacity globally. One interesting read through is MEC ($4971.TYO), a Japanese specialty chemicals company with an effective monopoly on the CZ series adhesion promotion chemistry used in ABF substrate manufacturing. The chemistry is critical. It enables copper circuitry to bond to the build up film and is applied at every layer of the substrate. MEC’s latest disclosures show sales to China growing far faster than to any other region. This looks like an important signal that Chinese substrate makers are investing aggressively to build the technical expertise and capacity needed to compete in ABF. Some of the increase may come from non Chinese suppliers manufacturing in China, such as AT&S and Zhen Ding. But it is hard to see that alone explaining the magnitude of the increase. The takeaway: China’s push into ABF substrates looks increasingly real, and MEC’s chemistry sales may be one of the better ways to track it.
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This is an inflection. The company is moving from a Front-End Equipment business with a small Back-End segment, to a full out Packaging Equipment company.
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Shibaura ($6590.TYO) ORDERS. Why aren't more people talking about this?
Shibaura ($6590.TYO) ORDERS. Why aren't more people talking about this?
Korean HBM is increasingly headed to Malaysia vs. Taiwan: $INTC #EMIB# $TSM #CoWoS#
Ibiden Q1: BEAT AND RAISE 🔥 Sales ¥123B (+26% YoY), OP ¥26.9B (+52%) ABF substrates doing all the work - Electronics sales +38%, segment margin 27.6%. How to identify short supply: advances received jumped ¥74B in ONE quarter to ¥155B. Customers are prepaying billions to lock AI substrate capacity. FY guide raised to ¥127B OP - more than DOUBLE last year. H2 ramp incoming.
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