#SamsungSemiconductor# was among the first to integrate the #PMIC# directly on the substrate of #DDR5# DIMM for improved performance and system-level efficiency. Read more about how Samsung delivers energy-efficient PMIC solutions.

Think of a subway system, where thousands of commuters need to travel from point A to point B every day. In #DDR5# #DIMM# modules, the subway system is the #PMIC#. Learn more about the ways in which #SamsungSemiconductor# is delivering lower-power memory solutions.

Big news this wk for next HW Mate phone. M90 will be using Smartsens SCC85XS, 200 Mp CIS. The 1st domestic high end 200 MP CIS. Also use 50 Mp SC575XS & SC595XS. X8 will also use Smartsens chips. The smart phone supply chain is shifting to Chinese players across the full supply chain, not just in SoC, but also DRAMs, NAND chip, CIS, RFFE, PMIC, analog stuff. That's the outcome of tech war.

Fire at Vanguard (VIS) Fab 3 in Taoyuan, Taiwan last night. A rooftop mechanical room on the 4-story fab caught fire ~11:30pm local and was extinguished in under an hour. 200+ night-shift workers evacuated, no injuries. Fortunately, the fire was in a rooftop facility room, physically separated from the cleanroom and tools. Equipment was back up and running normally within 2 hours, and initial damage assessment is minimal. Fab 3 runs Vanguard's most popular 130-250nm processes, mainly for mobile and server PMICs, accounting for 20-25% of the company's 8-inch capacity. More serious damage to the fab would have caused significant disruption to Vanguard's operations.

UMC, Taiwan’s 2nd biggest chip foundry, is looking to expand a fab in south Taiwan due to an overflow of advanced packaging and specialty AI-related orders (silicon interposers, DTC) from Qualcomm, Intel and SanDisk, media report, noting new plans for UMC’s Fab 12A P7 near Tainan, Taiwan, are under evaluation. Orders for power management chips (PMICs) for AI products are also booming. UMC is working with Qualcomm on silicon interposers, DTC (deep trench capacitors), and wafer-to wafer hybrid bonding, while Intel and UMC have partnered on 12nm FinFET, and the UMC-SanDisk cooperation is for memory chip stacking. The story cites unnamed industry sources. $UMC $QCOM $SNDK $INTC #semiconductors#