Gen Z’s AI Confidence Cracks: Young Americans Now Fear Job Loss as Much as Older Workers Young Americans are becoming increasingly worried that artificial intelligence will eliminate jobs. According to a new Pew Research Center survey, 73% of U.S. adults aged 18–29 believe AI will lead to fewer jobs over the next 20 years, up sharply from 61% in 2024. That puts young adults almost level with people aged 30–49 (74%) and 50–64 (72%). Overall, 71% of Americans expect AI to reduce job availability, suggesting that concerns about automation are no longer primarily an older-generation issue—they are becoming a major concern for the workforce’s youngest entrants as well

AI Hardware Demand Growth and Representative US-Listed Companies June 2026 Executive Summary Nvidia’s transition to the Vera Rubin (VR200) platform marks a significant escalation in AI infrastructure complexity and cost. Our BOM teardown of the next-generation Rubin rack reveals a ~2x increase in total rack cost to approximately $7.8 million (vs. ~$4 million for GB300), driven not solely by the GPU/CPU but by sharp revaluations across the supply chain. Key highlights from downstream components include: • PCB content value +233% YoY, the largest increase. • MLCC +182%, reflecting higher density and count (e.g., ~600k MLCCs per VR200 NVL72 server, +30%+ vs. GB300). • ABF substrates +82%, power solutions +32%, and liquid cooling +12%. These upgrades align with broader AI scaling: 800G/1.6T optical transceivers ramping aggressively, glass-based technologies advancing for packaging and interconnects, and hyperscalers prioritizing performance, power efficiency, and thermal management. We expect sustained multi-year tailwinds for the AI hardware ecosystem into 2027+, with Rubin-driven demand accelerating in H2 2026. Investment Thesis: While Nvidia (NVDA) remains the core beneficiary, the supply chain offers diversified exposure. We favor companies with direct exposure to high-growth areas like advanced PCBs, high-speed optics, and glass substrates/optical interconnects. Risks include execution on new capacity, potential margin pressure from rapid scaling, and geopolitical supply chain factors. 1. PCB: Sharpest Value Uplift in Rubin BOM Morgan Stanley’s detailed analysis shows PCB content in the Rubin rack surging +233% versus GB300. This reflects needs for higher layer counts, advanced materials, better signal integrity, and larger formats to support increased power and interconnect density in AI servers. US Representative: TTM Technologies (TTMI) – Leading US PCB manufacturer with strong positioning in high-complexity boards for data center/AI applications. TTM has invested in capacity expansions (e.g., new facilities) to capture AI-driven demand for advanced HDI and high-layer PCBs. 2. MLCC: Density-Driven Surge Nvidia’s VR200 NVL72 platform requires ~600,000 MLCCs per server, over 30% more than GB300. Combined with the +182% value increase in the BOM, this underscores tightening supply for high-capacitance, high-reliability MLCCs in power delivery and decoupling for AI accelerators. Exposure Note: The MLCC market is dominated by Asian players (e.g., Murata, Samsung Electro-Mechanics, Yageo). US-listed indirect exposure may come through broader electronics or power solution providers, but direct pure-play opportunities are limited. Watch for capacity utilization tightness benefiting the ecosystem. 3. Optical Communication: 800G/1.6T Ramp Accelerating Chinese leader Zhongji Innolight reported Q1 2026 net profit +262% YoY, driven by strong 800G/1.6T shipments, with expectations of significant full-year growth. This mirrors industry-wide momentum as AI clusters shift toward higher-speed optics for reduced latency and power in scale-out/scale-up networking. Nvidia’s investments in photonics and CPO further validate the trend. US Representatives: • Coherent (COHR) and Lumentum (LITE): Key players in optical components and transceivers; Nvidia has made substantial equity investments to secure capacity. • Corning (GLW): Major beneficiary via optical fiber, connectivity, and glass technologies (detailed below). 4. Micro-LED/Glass Substrates & Optical Interconnects: Strategic Partnerships Accelerating On May 20, 2026, BOE announced a cooperation MOU with Corning covering glass-based encapsulation carriers, foldable glass, perovskite substrates, and optical interconnect applications. This aligns with industry shifts toward glass cores for superior flatness, thermal stability, and integration in advanced packaging and photonics—critical for next-gen AI as organic substrates hit limits. US Representative: Corning (GLW) – Central to Nvidia’s optical strategy with multi-billion partnerships, new US optical factories, and expansion in fiber/photonics for AI data centers. Recent deals position GLW for 10x+ capacity growth in key areas. AI Hardware Demand Growth & US-Listed Representative Companies Table Component Demand Growth (vs. GB300) Key Drivers US-Listed Reps Investment Rationale PCB +233% value Higher layers, HDI, signal integrity TTM Technologies (TTMI) Direct AI server/backplane exposure; US capacity expansion MLCC +182% value; +30%+ count Power density in servers Limited direct (ecosystem via power suppliers) Supply tightness supports pricing/volume Optical Comm (800G/1.6T) Strong ramp (e.g., +262% profit ex.) Scale-out networking, CPO transition Coherent (COHR), Lumentum (LITE), Corning (GLW) Nvidia investments; transceiver/fiber boom Glass Substrates/Interconnects Emerging (MOU-driven) Packaging, photonics, thermal/optical Corning (GLW) Nvidia factory deals; US manufacturing tailwinds Power & Liquid Cooling +32% / +12% Higher TDP (e.g., 2300W GPUs) Indirect (ecosystem) Secondary but critical for rack deployment Source: Morgan Stanley BOM analysis, company reports, industry data. Growth metrics approximate from Rubin teardown. Outlook & Risks We project robust 2026-2027 growth in AI capex, with Rubin shipments catalyzing another leg-up in component demand. Optical and advanced substrate shifts could extend the cycle beyond traditional GPU focus. Hyperscalers’ vertical integration and US onshoring (e.g., Corning/Nvidia factories) add resilience. Key Risks: Cyclical capex pauses, yield/execution challenges on new tech (glass/CPO), commodity volatility in passives, and intense competition in Asia-heavy segments. Valuation multiples in the space have expanded; selectivity is key. Recommendation: Overweight select supply chain names with strong Nvidia alignment (e.g., TTMI for PCBs, COHR/LITE/GLW for optics/glass). Monitor Q2 2026 earnings for confirmation of Rubin ramp momentum.

📈 US Market Pre-Market Intelligence | June 3, 2026 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Sources: CNBC · Benzinga · StockTwits · The Motley Fool · TheStreet Pro · Reuters · Bloomberg · LSEG · FTSE Russell · · Yahoo Finance · The Globe and Mail Data window: Past 24h (priority: past 12h) ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 【Market Snapshot】 • S&P 500 Futures: -0.3% | Nasdaq futures: +0.4% • VIX: 15.77 (1-year low, neutral-low) • Fear & Greed: 66 (Greed zone) • WTI Crude: ~$93/barrel (Iran tensions supporting) • Dollar Index: DXY 107.2 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 【SECTION 1: TOP NEWS — TECH/AI/SEMICONDUCTOR】 🔥 Jensen Huang at GTC Taipei (June 2-3, 2026): The Single Biggest Catalyst ━━━━━━━━━━━━━━━━━━━━ Source: The Motley Fool · StockTwits · Bloomberg · Reuters · Yahoo Finance · BigGo Finance · Times of India · DataCenterNews Asia 1. MRVL +32.5% Tuesday → all-time high. Huang on stage: "Matt [Murrett] is building the next trillion-dollar company." MRVL premarket today: +22%. → Custom AI chips (non-NVDA) = the new AI alpha. Gary Black (top Tesla/tech fund manager): "Broadcom and Marvell are the big winners as focus shifts to custom AI ASICs." 2. AVGO + Broadcom: Hit 52-week high alongside MRVL. Custom AI networking/DPU chips gaining enterprise share. Gary Black: AVGO is a "big winner" in the custom chip shift. 3. HPE Hewlett Packard Enterprise: Hit 52-week high premarket. Analyst (StockTwits): "AI-driven quarter — shares deserve a higher multiple." Aruba/AI infrastructure backlog strong. 4. NVIDIA Vera Rubin platform: Full production announced at GTC Taipei today (June 3). Next-gen AI data center GPU. NVDA stock slightly lower premarket (-0.5%) as markets digest the rally in competitors MRVL/AVGO. 5. TSMC ADR hit record high +2.5%. Deepened NVIDIA partnership confirmed at GTC Taipei. Philadelphia Semiconductor Index (SOX) surged 5.9% to all-time peak — biggest single-day move in 2026. 6. IPG Photonics, MACOM, Amkor: All skyrocketed after Huang's GTC Taipei keynote. AI photonics + advanced packaging = next bottleneck. 7. Trump Executive Order: Government gets early access to advanced AI models. StockTwits called it "pro-AI infrastructure" signal. Microsoft + NVIDIA partnership: RTX Spark + Vera CPU for Windows AI laptops. Build 2026 event this week. 8. MU Micron: UBS upgraded to $1625 target — more than 100% upside. HBM memory demand = structural supercycle. ⚠️ Warning Signal: Michael Burry (The Big Short): AI chip rally is within 7% of 2000 dot-com bubble peak. Chart suggests caution on AI momentum names. Retail vs. institutional positioning diverging. ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 【SECTION 2: RETAIL SENTIMENT — STOCKTWITS/TRADINGVIEW/WALLSTREETBETS】 Source: StockTwits · TradingView News · TheStreet Pro · Yahoo Finance ━━━━━━━━━━━━━━━━━━━━ 📊 Most-discussed tickers by retail (past 24h): • MRVL: Trending #1# on StockTwits. Retail piling in after Huang shoutout. Bullish comments dominate. "MRVL to $200" comments everywhere. • AVGO: Custom chip theme driving retail interest. "This is the NVDA of 2026" sentiment growing. • ASTS (AST SpaceMobile): Snapped 2-day losing streak. Top execs buying shares = vote of confidence. SpaceX IPO buzz creating turbulence but long-term thesis intact. Retail mostly bullish. • RKLB / LUNR / RDW: Slipping on SpaceX IPO speculation. Bears say SpaceX could cannibalize launch demand. Bulls watching. • META: Retail sees buying opportunity. Stock still trails Mag 7 peers despite new subscriptions + layoffs + cloud plans. "META cheap vs. GOOGL/AMZN" sentiment. • TSLA: Dips on SpaceX merger rumors. Retail influencer: "Bull case adds $450B to valuation." SpaceX IPO terms uncertainty weighing. • INTC Intel: Surprising surge today. Investors asking "why is Intel surging?" AI PC + foundry turnaround narrative returning. ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 【SECTION 3: MARKET THEMES — AI ROTATION + SMALL CAP BREAKOUT】 Source: The Globe and Mail · 247WallSt · Benzinga · AInvest · TheStreet Pro · LSEG ━━━━━━━━━━━━━━━━━━━━ 🚀 AI Money Rotating from Mega-Cap → Small/Mid Cap: • Small caps are AI's big winners in 2026 (The Globe and Mail, Reuters, 10 hours ago) • Russell 2000 small-cap value has beaten growth by 9 percentage points YTD • Something rare is driving the Russell 2000 — and AI is the answer (Benzinga) • AI exuberance rotating into small caps amid sticky inflation (ActionForex) • IWM, VTWO, URTH all flashing strong buy signals (MarketsHost) 📊 Russell 2000 reconstitution underway (FTSE Russell, May 22 announcement): Total US equity market cap in Russell 3000 reached $75.6 trillion — 29% increase from prior year. Major index changes creating volatility + opportunities. 💰 Sector rotation: Energy (oil $93, Iran) + AI semis + small-cap value = today's leadership. Defensive sectors (utilities, consumer staples) outflowing. ⚡ Middle East: Oil supported at $90-95 range. US-Iran tensions escalating (missiles launched toward Kuwait/Bahrain per fxstreet). Energy stocks (XOM, CVX) get tailwind. ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 【SECTION 4: KEY STOCKS — PREMIER DATA FROM AUTHORITATIVE SOURCES】 Source: StockTwits · The Motley Fool · Yahoo Finance · Benzinga · TheStreet Pro ━━━━━━━━━━━━━━━━━━━━ 🔥 MRVL — Marvell Technology Price: ~$140+ (premarket +22%) | 52-week HIGH Catalyst: Jensen Huang at GTC Taipei: "next trillion-dollar company" Analyst: Gary Black — "big winner" in custom AI chip theme Analyst: Morgan Stanley sees $120+ target Narrative: AI custom ASIC for cloud. Google's TPUSnake, Amazon's Trainium = MRVL customers. Data center custom silicon = secular trend. Risk: Rich valuation. PS 20x. Momentum + Huang boost = near-term overbought. 📊 AVGO — Broadcom Price: ~$220+ | 52-week HIGH Catalyst: Custom AI networking chips + VMware synergy Narrative: #2# AI chip play after NVDA. Custom DPUs + networking for AI data centers. Gary Black: "big winner" alongside MRVL Risk: Valuation already pricing in strong growth 🚀 HPE — Hewlett Packard Enterprise Price: premarket +strong | 52-week HIGH Catalyst: AI-driven quarter beat. Aruba networking + GreenLake AI services. Analyst quote (StockTwits): "AI quarter — shares deserve higher multiple" Narrative: AI infrastructure + edge computing + hybrid cloud = multi-year growth Risk: Competition from Dell/Arista in AI networking 💡 TSMC — Taiwan Semiconductor ADR Price: $446.69 (+2.5% record high) Catalyst: NVIDIA partnership deepened at GTC Taipei. Advanced node capacity = structural moat. Narrative: Foundry king. AI compute demand = capacity fully booked for 2026-2027 Risk: Taiwan geopolitical risk premium always present ⚡ IPG Photonics / MACOM / Amkor Price: all skyrocketed after GTC Taipei keynote Catalyst: AI photonics (laser/optical interconnect) + advanced packaging (Amkor = chiplet packaging) Narrative: AI hardware bottleneck shifting from compute → interconnect + packaging Risk: Volatile momentum names ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 【SECTION 5: SMALL-CAP US ALPHA 🔍】 Serenity Framework: Demand → Earnings → Small-Cap Elasticity → Verification ━━━━━━━━━━━━━━━━━━━━ 📌 IWM — iShares Russell 2000 ETF | Small-Cap Core Trigger: Russell 2000 hit strong buy signals; small-cap value beating growth by 9pts YTD; AI rotation into small caps confirmed (The Globe and Mail) Elasticity: Russell 2000 constituents with AI exposure = leverage to sector rotation Verification: FTSE Russell reconstitution underway; IWM options volume surging Catalyst: ADP jobs data today; Fed speakers this week; Russell reconstitution culminates end of June Risk: Rate sensitivity if jobs data hot → delay Fed cuts → small caps hurt 📌 FLNC — Fluence Energy | AI Data Center Cooling Trigger: Jensen Huang GTC keynote emphasized AI data center infrastructure at scale. Cooling/power = next bottleneck as compute density explodes. Elasticity: AI data centers need liquid cooling at scale — FLNC is leader in modular battery/cooling systems Verification: Stock up strongly post-GTC keynote. Institutional buying volume rising. Catalyst: Next earnings — watch backlog. If backlog grows >40% YoY = confirm supercycle thesis. Risk: Competition from Schneider Electric / Vertiv 📌 SOXL — Direxion Daily Semiconductor Bull 3X Trigger: Philadelphia Semiconductor Index +5.9% to all-time high. TSMC record. MRVL +32%. AI chip theme = institutional inflow. Elasticity: 3x leveraged ETF = amplified move in semiconductor sector Verification: SOXL options activity spiking. Retail interest elevated (StockTwits trending). Catalyst: Any NVIDIA/AMD/MU earnings beat = SOXL pops 5-8% same day Risk: 3x leverage = decay risk. Only for short-term tactical use. ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 【SECTION 6: MACRO + MARKET STRUCTURE】 Source: Bloomberg · Reuters · fxstreet · LSEG · FTSE Russell ━━━━━━━━━━━━━━━━━━━━ 📅 Today's Key Events (June 3, 2026): • ADP Private Sector Employment (May) — consensus: +180K • ISM Services PMI (May) — flash PMI showed expansion, services follow-up • EIA Weekly Crude Inventory • Fed speakers: likely to maintain data-dependent stance • GTC Taipei keynote continues (NVIDIA ecosystem announcements) ⚠️ Key Risks: 1. Iran/Middle East escalation → oil spike >$95 → inflation risk → Fed hawkish 2. AI chip rally froth (Burry warning) → sector could see sharp 5-10% correction 3. SpaceX/OpenAI/Anthropic IPO timeline: Standard Chartered warns "market oxygen being sucked out" when these hit 4. Tariff fatigue: Section 301 tariffs on 60 economies (forced labor) could hit supply chains 5. MU/TSMC: Any supply disruption from Taiwan Strait tension = semiconductor sector crash ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 【SECTION 7: INSTITUTIONAL FLOWS】 Source: LSEG · FTSE Russell · Bloomberg ━━━━━━━━━━━━━━━━━━━━ • AI/Infrastructure: MRVL, AVGO, HPE, TSM — HEAVY institutional accumulation • Energy: XOM, CVX — inflows on oil geopolitics premium • Small-cap value: IWM, VTWO — first real institutional rotation signal of 2026 • Outflows: Utilities (XLU), Consumer Staples (XLP), REITs — rate sensitivity • Crypto/Fintech: COIN, SQ — mixed; Bitcoin holding $95K support ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 【INVESTMENT SUMMARY — 3 Scenarios】 🔵 Bull Case: AI custom chip theme continues → MRVL/AVGO/TSM lead → small caps catch fire → Russell 2000 breaks out → IWM $250+ Catalyst: MU earnings beat, AMD data center beat, ADP jobs soft (Fed cuts priced in) 🔴 Bear Case: Burry warning correct → AI chip rally peaks → MRVL/AVGO reverse → Nasdaq -3% correction Catalyst: Strong ADP + hot inflation → rate cut timeline pushed out → small caps get crushed 🟡 Base Case: AI infrastructure secular bull → semis consolidate at high level → small caps rotate in/out in tranches → VIX stays 15-18 Catalyst: No major catalyst → range-bound S&P 500 with sector divergence ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ ⚠️ Disclaimer: This content is for informational purposes only and does not constitute investment advice. Data sourced from public English-language financial media (CNBC, Bloomberg, Reuters, StockTwits, Benzinga, The Motley Fool, TheStreet, LSEG). Historical performance does not guarantee future results. Consult a licensed financial advisor before investing.

👀 #MediaTek# confirms its AI ASIC collaboration with #Intel’s# EMIB-T advanced packaging. The chipmaker is now pushing 400G SerDes IP to target next-gen ASIC opportunities, including reportedly #Google’s# TPU v10 and Meta’s custom AI chips.💡More: 🔗

NVIDIA JUST CONFIRMED ITS NEXT-GEN CHIPS ARE ON SCHEDULE, AND MADE A DIRECT COMPARISON TO AMD IN THE SAME BREATH Nvidia $NVDA says its chips remain on track for use in AI data centers. The company also says its new Vera processor is faster than AMD's Turin. Nvidia said a major customers are already testing Vera Rubin hardware.

Chris Camillo tells Gen Z to skip college to become a hyper-proficient AI specialist "If you're just a regular and young person, spend 6 months becoming a top 1% person in AI by self-learning" "Go where wealthy business owners hang out. I don't care if it's a conference in Vegas, go to the hotel bar and start walking up to old guys who are likely business owners or C-level execs" "Introduce yourself and say, I just spent 6 months becoming hyper-proficient at using bleeding-edge AI tools to solve problems. Over the next 3 years, your business is going to have so many issues and I'll be able to solve them for pennies on the dollar" "I don't know how many people you have in your company who are hyper-proficient in AI right now. But I am. Can we talk?" "Have that conversation over and over until one of them goes, I don't even know what I'm going for use you for, but we're hiring you next week"

Dunamu and Visa announced a strategic partnership around stablecoin and AI-based next-gen payments, unveiled by Dunamu CEO Oh Kyung-suk and Visa global president Oliver Jenkyn in San Francisco. The scope covers stablecoin-based payments and global remittance broadly, no specific product structure confirmed yet, they're planning to develop it step-by-step depending on how the regulatory framework shapes up. Notably, they're also exploring business models built on OUSD, the Open Standard consortium's dollar stablecoin, the same one that landed 13 Korean companies on its partner list back in June, several of whom said they'd never formally agreed to join. The AI angle is the more forward-looking piece: combining AI with stablecoin settlement infrastructure, specifically looking at "agentic commerce," AI agents autonomously searching, purchasing, and paying on a user's behalf, and the payment infrastructure that would require.

Lt Gen MU Nair (Retd), Former National Cyber Security Coordinator, delivered an insightful lecture on "Cyber Warfare in India" to Student Officers of #DSTSC09#, and #MPCTC78#, including officers from Friendly Foreign Countries at #MILIT#. He underscored that future conflicts will be shaped by superiority in information, data, networks and decision-making. Emphasising cyber sovereignty, resilient digital infrastructure, AI and trusted communications, he highlighted the critical role of cyber capabilities in the evolving multi-domain battlespace. @DefenceMinIndia @SethSanjayMP @SpokespersonMoD @MIB_India #ProfessionalMilitaryEducation#

15 stocks Anchoring the AI Infrastructure Buildout: $MU — Micron's HBM ramp has been one of the clearest beneficiaries of the AI memory supercycle alongside SNDK, and pricing power across DRAM and NAND has held up far better than prior cycles suggested it would. $NVDA — Still the anchor of the entire buildout. Every other name on this list exists in some relationship to Nvidia's roadmap, whether as a supplier, a customer, or a competitor trying to chip away at share. No large-cap AI thesis is complete without acknowledging where the center of gravity still sits. $AMD — Two separate catalysts stacking here. Helios and the next-gen CPU lineup represent a real inflection point on their own. But the more interesting development is AMD effectively borrowing Nvidia's NeoCloud flywheel playbook — helping partners raise capital that gets recycled into buying AMD GPUs. $COHR — Coherent's optics and photonics exposure puts it right in the middle of the bandwidth bottleneck story — as data center interconnect speeds keep climbing, this is one of the picks-and-shovels names benefiting from every upgrade cycle. $AMZN — The Trainium ramp is hitting its stride right now. Custom silicon is becoming a bigger piece of Amazon’s AI infrastructure story, reducing reliance on third-party GPUs while giving AWS more control over cost and supply — a dynamic that should keep showing up in margin trends. $JBL — The story here is the 1.6T LRO optical transceiver ramp. What's underappreciated is the margin profile — as these ramps mature and volumes scale, blended margins tend to surprise to the upside relative to what the Street models in. $SNDK — The recent investor conference did real work reinforcing the bull case: this isn't a cyclical memory blip, it's durable, higher-margin revenue that should hold up over the next several years. Memory has been one of the more volatile corners of the thesis, so a credible durability argument matters. $RDDT — Now sitting in the S&P 500, and honestly this one has just quietly compounded, quarter after quarter, without much drama. Index inclusion tends to bring a fresh wave of forced buying and attention — this name has earned it on fundamentals first. $TSM — Still the center of gravity for the entire AI buildout. Every layer of this thesis — GPUs, custom silicon, networking chips — ultimately routes through TSMC's fabs. As close to a toll-booth position on the whole AI capex cycle as exists. $AMKR — Backstopped growth via Nvidia and TSMC contracts gives this one a floor most packaging/assembly names don't have. Advanced packaging is a bottleneck layer in this whole buildout, and Amkor's contract visibility reflects that. $SMCI — The ~$70B revenue ramp targeted for 2027 is a genuinely staggering number for a server integrator. If that materializes anywhere close to plan, the scale of the AI server buildout embedded in that estimate says a lot about where hyperscaler and enterprise capex is headed. $SKHY — SK Hynix has been the clearest HBM leader through this memory cycle, posting record profits on the back of that positioning, and still seems underdiscussed relative to how central it is to the AI memory stack. $GFS — strategic domestic semiconductor capacity is clearly a policy priority now. On top of that, I think CPO exposure gives GlobalFoundries another leg of revenue acceleration going forward. $AVGO — Broadcom sits at the center of the custom ASIC and networking layer, designing the XPUs that hyperscalers use to reduce Nvidia dependence while also owning critical switching/networking silicon. $CEG — Constellation Energy is one of the cleanest ways to play the power-for-AI-datacenters theme. Nuclear capacity is increasingly the preferred baseload source hyperscalers are contracting for directly, and Constellation's fleet gives it real leverage in those negotiations. Not financial advice.

The Q-glass vs. PTFE debate is still raging, but the ground truth is clear: ultra-high layer count AI boards are locked in for the M9 + Q-glass setup. 🧵👇 PTFE materials cause severe processing bottlenecks in drilling and lamination. It’s so problematic that even Shengyi Tech had to alter its PP formulations. Looking into 2027, the volume ramp-up of next-gen LPUs (featuring massive 52-layer designs) will trigger a massive surge in Q-glass demand. PTFE will remain strictly confined to low-layer topologies. #PCB# #Semiconductor# #AI# #SupplyChain# #Hardware#