GlobalFoundries press release, Oct 8: $GFS locked a multi-year manufacturing deal with $TSM , sized at about $2 billion, to make silicon interposers for TSMC CoWoS advanced packaging out of its Malta, New York fab. Per the company, Malta would become the first U.S.-based source of those interposers, including embedded deep trench capacitor parts. Initial term is five years. Volume production is expected to ramp in the first half of 2028. Advanced packaging has been the bottleneck on AI silicon, not just wafer starts. A U.S. interposer line does not clear CoWoS overnight, but it is a dated capacity add with a named site, not another vague framework. Next to watch: whether Malta actually hits that H1 2028 ramp, and how much of TSMC interposer mix moves stateside.