We're expanding our longstanding strategic partnership with BE Semiconductor Industries N.V. (Besi), as they join our EPIC Center as an Innovation Partner. The collaboration builds on our companies’ joint development program launched in 2020 and extends co-innovation beyond hybrid bonding into new interconnect architectures and applications supporting the semiconductor industry's AI-driven scaling roadmap. “Besi has been a trusted partner since we began co-developing next-generation hybrid bonding solutions. With Besi joining EPIC as an Innovation Partner, we’re extending that collaboration across the interconnect technologies our customers need to scale AI systems. Bringing this work into Applied's EPIC Center gives both companies earlier visibility into where the roadmap is headed and lets us co-optimize the full packaging flow.” – Gary Dickerson, President and CEO of Applied Materials Learn more: