We've presented our longer-term growth expectations and outlined how our leadership in materials engineering positions the company to outperform the wafer fab equipment market over the coming years. Learn more:

We're working with @Intel Corporation to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies. The collaboration will bring together cutting-edge capabilities from our EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon to shorten time-to-market of advanced semiconductor technologies essential to AI computing. “Applied and Intel share a decades-long history of deep collaboration focused on pushing the boundaries of materials engineering to advance the semiconductor roadmap. Bringing our teams together at the EPIC Center will deepen that partnership and accelerate the transistor, interconnect and packaging innovations needed to drive the future of AI computing.” - Gary Dickerson, President and CEO of Applied Materials Learn more:

We're expanding our longstanding strategic partnership with BE Semiconductor Industries N.V. (Besi), as they join our EPIC Center as an Innovation Partner. The collaboration builds on our companies’ joint development program launched in 2020 and extends co-innovation beyond hybrid bonding into new interconnect architectures and applications supporting the semiconductor industry's AI-driven scaling roadmap. “Besi has been a trusted partner since we began co-developing next-generation hybrid bonding solutions. With Besi joining EPIC as an Innovation Partner, we’re extending that collaboration across the interconnect technologies our customers need to scale AI systems. Bringing this work into Applied's EPIC Center gives both companies earlier visibility into where the roadmap is headed and lets us co-optimize the full packaging flow.” – Gary Dickerson, President and CEO of Applied Materials Learn more: