Today, Ayar Labs, Wiwynn, and GUC are presenting a live demonstration showcasing Wiwynn’s compute system integrating GUC's ASIC with Ayar Labs' TeraPHY™ optical engine paired with SuperNova™ light source, streaming real-time health telemetry. Full PR:

At #AIInfraSummit#, our Director of Product Management walks through what it takes to bring CPO to market, including TSMC’s advanced process nodes, ASIC design service providers, external laser sources, and fiber connectivity. From NextGenInfra:

We're heading to the OCP Global Summit (Oct 12–15, San Jose) with Wiwynn at Booth C74, where we will showcase a live demonstration of our optically-connected rack. More information: #OCPSummit26# #optical# #photonics# #semiconductor# #AI#

AI Infra Summit brought the whole ecosystem into one room. Thank you to everyone who filled the room for the Data Movement Track session, to the industry leaders and panelists who made the CPO Summit possible, and to every visitor who came by the booth. #AIInfraSummit#

Ayar Labs and @GUC_ASIC jointly conducted a thermal co-simulation of CPO in a complex advanced multi-chip package. The results show that CPO can operate reliably within the thermal envelope of advanced packages with the right liquid cooling. Full blog:

Ayar Labs optical engines are built using TSMC's packaging and silicon technologies, and we're at TSMC OIP today with our ASIC design partners to show what that integration looks like. See our collaboration with Alchip (booth #216#) and GUC (booth #608#). #TSMCOIP2026#

Conversation with Ayar Labs CEO Mark Wade on Silicon Photonics, Co-Packaged Optics, and Next-Gen AI Infrastructure With @BenBajarin and @jaygoldberg. 0:00 Introduction and the interconnect bottleneck 2:29 The high-level pitch for IR Labs and optical connectivity 4:42 Why building optical solutions is so difficult 7:30 Why now? The catalyst of ChatGPT 11:46 The complexities of advanced packaging and manufacturing 16:05 Navigating the future landscape of interconnects 21:00 Exploring digital twin manufacturing models 24:54 IR Labs' core bet on CMOS-scale foundries 28:06 Confidence in the TSMC COUPE process 33:48 Customer adoption hurdles and strategic partnerships 38:05 Funding strategy, Series E, and the path to IPO 43:40 Interacting with Wall Street and public investors 48:24 Wrap-up and future market size estimates

At AI Infra Summit, Ayar Labs is showcasing co-packaged optics at rack scale with Wiwynn and how a robust ecosystem across advanced packaging, ASIC design, and optical connectivity brings CPO to high-volume manufacturing.

Ayar Labs is opening an India Design Center in Bengaluru. As co-packaged optics moves into commercialization and production, the new site will expand our end-to-end engineering capabilities across silicon product development. Read more:

Today, Ayar Labs announced it has secured an additional $150 million in funding, bringing its total primary capital raised in 2026 to $650 million. Full press release: #optical# #photonics# #semiconductor# #AI# #CPO#

📌 Co-Packaged Optics for Agentic AI Infrastructure 🗣️ Vivek Gupta, Chief Strategy Officer at Ayar Labs 🗓️ Thursday, September 15, 11:00 – 11:20 a.m. 🌍 #AIInfraSummit# – Santa Clara, California More information:

📌 Keynote: Productizing TeraPHY Optical Engines – Challenges & Opportunities 🗣️ Vivek Khanzodé, VP of Systems Engineering, Ayar Labs 🗓️ Thursday, September 3, 1:55 – 2:35 p.m. 🌍 #SEMICONTaiwan2026# – Taipei, Taiwan More information:

"Copper interconnects have become one of the biggest obstacles to realizing the vision of open computing." As system complexity rises, optics can truly free rack design from these constraints. Read the full article by DIGITIMES:

We are back at AI Infra Summit! From September 15-17, visit us at booth 804 to experience how CPO changes the future of AI infrastructure. More Information: #AIInfraSummit# #optical# #photonics# #semiconductor# #AI#

This week’s Spotlight is on Vladimir Stojanović, a Berkeley professor and co-founder of @AyarLabs whose work is helping solve one of the biggest constraints in modern AI infrastructure: moving enormous amounts of data between chips quickly enough and efficiently enough to keep up with compute. Vladimir’s research spans integrated circuits, computer architecture, and silicon photonics. In 2015, he helped lead the team behind the first processor capable of using light to communicate directly with the outside world - a Berkeley research breakthrough, in collaboration with MIT and the University of Colorado Boulder, published in Nature. That research became the foundation for Ayar Labs, which Vladimir co-founded and now serves as CTO. As AI systems scale across hundreds or thousands of GPUs, the connections between those processors become a major bottleneck. Traditional copper connections are limited in how much data they can carry, how far they can carry it, and how much power they consume in the process. Ayar Labs is addressing that problem by moving data with light. Its optical I/O technology is designed to connect thousands of GPUs across racks with the bandwidth, low latency, and power efficiency required for the next generation of AI systems. @thehousefund was proud to back Ayar Labs since the Seed round, when replacing electrical chip connections with optical ones still sounded like a highly ambitious research bet - and few were talking about AI. The company has since raised nearly $900M, reached a $3.75Billion valuation, and built partnerships across the semiconductor ecosystem as it moves the technology toward high-volume deployment. AI progress is often framed around bigger models and more powerful GPUs. But those systems only work if the underlying hardware infrastructure can move data fast enough to keep all that compute productive. Vladimir and the Ayar Labs team have spent more than a decade building for that reality. Another great example of Berkeley research becoming infrastructure the next era of technology may depend on.

Vishal Chandrasekar, director of product management at Ayar Labs, sat down with TechArena to explain how co-packaged optics (CPO) takes AI scale-up beyond the rack and the manufacturing readiness required to achieve high-volume production. Full Q&A:

As silicon photonics moves toward volume production, designing the PIC is only part of the challenge. Designs become more complex once the optical engine is tied to a foundry process, packaging strategy, and system architecture. On @SemiEngineering:

CPO overcomes the limitations of traditional copper and pluggable optics by enabling thousands of GPUs to operate as a single unified system with the bandwidth and latency needed for hyperscale AI infrastructure. Ayar Labs’ CPO solution:

Today, @AyarLabs announced it has joined the @nvidia NVLink Fusion ecosystem, introducing co-packaged optics as a foundational building block for hyperscalers and system innovators deploying heterogeneous compute in NVIDIA AI factories. Press Release:

Ayar Labs and Wiwynn are partnering to bring CPO to rack-scale AI systems that support next-generation hyperscale AI workloads. By combining Ayar Labs’ CPO solution with Wiwynn’s rack-level system design and manufacturing capabilities, the two companies are enabling a new class of rack-scale AI infrastructure.