John Intel(@intelfabs):Morgan Stanley still expects EMIB-T to remain the primary packaging solution, not be replaced by CoWoS. TSMC is acting as overflow capacity rather than taking the entire opportunity It could scale to support roughly 2.5 million TPU units by 2028, giving Intel an estimated 10-15% share of the advanced 2.5D packaging market. $INTC

John Intel

@intelfabs

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John Intel@intelfabs

2026.09.29 03:17

Morgan Stanley still expects EMIB-T to remain the primary packaging solution, not be replaced by CoWoS. TSMC is acting as overflow capacity rather than taking the entire opportunity It could scale to support roughly 2.5 million TPU units by 2028, giving Intel an estimated 10-15% share of the advanced 2.5D packaging market. $INTC